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3D magnetic field analysis

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... length of ≈ 180 µm by ≈ 45 µm (≈ 5 µm at the narrowest point). This view also reveals the relative position of the ROI within the 3D structure of the sample, which can guide cross-section analysis. Abstract Abstract Magnetic field imaging (MFI), generally understood as mapping the magnetic...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... in 2.5D Device comprising High Bandwidth Memory (HBM) Stacks and Processor Unit Using 3D Magnetic Field Imaging ,” in Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis , Fort Worth , 2016 . [11] Orozco A. , Gaudestad J. , Gagliolan N...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... Analysis with 3D X-ray Microscopy . ZEISS Application note. 2019 [21] Choi D , et al : “ Advanced Non-destructive Fault isolation techniques fo PCB substrates using magnetic current imaging and terahertz time domain reflectometry ,” Proc. 44th Int. Symp. Test. Fail. Anal. (ISTFA) , Nov...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... patterning, probe pad fabrication Bulk silicon removal, TEM lamella preparation, package deprocessing, package and BEOL failure analysis, 3D tomography [10] Figure 1 Modeled sputter yield (y) and implant depth of Cs + , Xe + , Ga + , Ar + , Ne + , and He + with a beam energy of 30keV...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050317
EISBN: 978-1-62708-311-9
... to the complexity of the electromagnetic field problem, no commercial computer simulation program exists for 3D coupled simulation of all induction system configurations. Also, the time that is required for direct 3D optimization of an induction-hardening system would take from weeks to months, even with today’s...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... ” Microelectronics Failure Analysis Desk Reference , Sixth edition , 330 – 339 ( 2011 ) [6] Knauss L.A. , Woods S.I. and Orozco A. “ Current Imaging using Magnetic Field Sensors ” Microelectronics Failure Analysis Desk Reference , Sixth edition , 301 – 309 ( 2011 ) [7] Vallett...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... filtered zero-loss TEM image of the area of interest showing the leakage path predicted by electrical analysis. No evidence of an anomaly is visible. (b) Energy-filtered silicon-plasmon image showing bright contrast indicative of polysilicon in the trench. (c) STEM bright-field image with enhanced...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220085
EISBN: 978-1-62708-259-4
.... These microscopes are commercially called “three-dimensional microscopes.” They use step motors to take images from a range of focal planes in the field of view and reconstruct them in a 3D color image of the sample that is presented in a monitor instead of in an eyepiece. The accuracy and quality of the images...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... for further analysis using SIL, Photon Emission, FIB edit, 3D X-ray, Magnetic mapping, Laser Stimulus, and so on. Backside sample preparation for through the silicon analysis has moved into the mainstream of FA in the last 5-10 years. While Moore’s law is concluding at the die level, the package...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110513
EISBN: 978-1-62708-247-1
... We Need Improved Wire-Bonding Methods ?”, proc. of 34th ISTFA, Nov . 2008 [11] Jacob P. , Jerjen I. , Nicoletti G. , “ Root-cause investigations of stitch bond - shearing by means of 3D-X-ray computer tomography (XCT), metallographic polishing and FIB ”. Proc. ISTFA 2010...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... inspection of the area with a 3D rendering of the data ( Figure 23b ) revealed a small, 5 Å ridge coincident with the leakage spot. C-AFM is a contact-mode technique in which an image is created representative of current flow through a sample. A constant electrical bias is applied to the sample...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.tb.hpcspa.t54460209
EISBN: 978-1-62708-285-3
.... CIRP , Vol 47 ( No. 2 ), 1998 , p 525 – 540 10.1016/S0007-8506(07)63240-5 8.15 Giffi C.A. , Gangula B. , and Illinda P. , “ 3D Opportunity for the Automotive Industry ,” Deloitte University Press, May 19 , 2014 , http://dupress.com/articles/ 8.16 Cormier Y...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2020
DOI: 10.31399/asm.tb.bpapp.t59290251
EISBN: 978-1-62708-319-5
... • Lima P. , Zocca A. , Acchar W. , and Gunster J. , 3D Printing of Porcelain by Layer-Wise Slurry Deposition , J. Eur. Ceram. Soc. , Vol 38 , 2018 , p 3395 – 3400 10.1016/j.jeurceramsoc.2018.03.014 • Miki T. , Takakura N. , Iizuka T. , Yamaguchi K. , Imanishi...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850165
EISBN: 978-1-62708-260-0
...Abstract Abstract This chapter explains how to achieve accurate, sharp delineation of the microstructure of metals using appropriate etching and contrasting techniques. It covers a variety of methods, including chemical etching, heat tinting, gas contrasting, vapor deposition, magnetic etching...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.9781627082808
EISBN: 978-1-62708-280-8
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smfpa.t53500133
EISBN: 978-1-62708-317-1
... at the edge of the steel strip, as shown in Fig. 7.23 Fig. 7.23 Steel strip used for the experiment and the temperature measurement point. Dimensions are in meters. Source: Ref 7.20 The simulation was conducted using DEFORM-3D. The following materials data were used as input parameters...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410029
EISBN: 978-1-62708-280-8
... for this application) Engine oil coolers Intake manifolds 4.5 Die Casting Process The die casting process is the most widely applied process for a variety of markets, led by the automotive field. Other markets that benefit from the die casting process are: Transportation, including trucking, off...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.9781627082600
EISBN: 978-1-62708-260-0
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030005
EISBN: 978-1-62708-282-2
... 10.1520/STP14920S 25. Veleva L. , Pérez G. , and Acosta M. , Statistical Analysis of the Temperature-Humidity Complex and Time of Wetness of a Tropical Climate in the Yucatan Peninsula in Mexico , Atmosph. Environ. , Vol 31 ( No. 5 ), 1997 , p 773 – 776 10.1016/S1352-2310(96...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2020
DOI: 10.31399/asm.tb.bpapp.t59290169
EISBN: 978-1-62708-319-5
... – 19 10.1111/j.1551-2916.2010.04210.x • Nandwana P. , Elliott A.M. , Siddel D. , Merriman A. , Peter W.H. , and Badu S.S. , Powder Bed Binder Jet 3D Printing of Inconel 718: Densification and Microstructure Evolution and Challenges , Curr. Opin. Solid State Mater. Sci...