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3D hot-spot localization

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110219
EISBN: 978-1-62708-247-1
...Abstract Abstract This chapter describes three approaches for 3D hot-spot localization of thermally active defects by lock-in thermography (LIT). In the first section, phase-shift analysis for analyzing stacked die packages is performed. The second example employs defocusing sequences...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... across the device is strongly damped [10] allowing the precise localization of the heat origin and is mostly used for short localization within individual components. The use of this methodology can be extended to hot spot detection on board level FA. Leakage current between conductive features like...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410009
EISBN: 978-1-62708-280-8
... engineer identifies the hot spots that would be the last areas to solidify. These areas need additional feeding to offset the shrinkage. He positions the feeders, makes minor changes to the wall thickness, and reruns the solidification analysis. He develops a further revised casting model and sends...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050317
EISBN: 978-1-62708-311-9
... to the complexity of the electromagnetic field problem, no commercial computer simulation program exists for 3D coupled simulation of all induction system configurations. Also, the time that is required for direct 3D optimization of an induction-hardening system would take from weeks to months, even with today’s...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220085
EISBN: 978-1-62708-259-4
... schematic of an SEM. A source generates a flow of electrons that are collimated and focused using a series of lenses and apertures. The magnetic field in the deflection coils will cause the electron beam to scan the sample (it is also possible to keep the beam on a single spot on the sample, i.e., when...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications. failure analysis integrated circuit boards integrated circuit packaging...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
... in a L3A140 package Figure 16 Thermal emission through the package detected a hot spot at one of the stacks of the dice (left). After decapsulation, the thermal emission detected the same emission site at the failing die location (right). Figure 17 Thermal emission at the die level...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110513
EISBN: 978-1-62708-247-1
... applications in a car and are, unfortunately, exposed to very harsh environmental conditions: they are located within gear transmissions (to precisely localize the positions of gearwheels) or even within the engine itself. In both cases, the devices are exposed to continuous, partially high-speed-flow of hot...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... . A thermal hot spot with a local temperature higher than T c could be identified with an analyzer filter. This technique was inexpensive and not very complicated but reproducibility was limited and homogeneous thickness of the deposition was problematic. With the transition to signal access through chip...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.9781627082808
EISBN: 978-1-62708-280-8
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850001
EISBN: 978-1-62708-260-0
..., Battelle-Columbus Laboratories.) Figure 1-4 Hot-acid etching of this disc from a bearing steel billet revealed broken corners, a lap (upper left), several small seams, and freckle-type segregation. Figure 1-5 Hot-acid etching of this 9-in square disc of AISI 4142 alloy steel revealed...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
.... , “ Low temperature wafer bonding for MEMS processes and 3D integration ”, 2012 3rd IEEE Int'l Workshop on Low Temperature Bonding for 3D integration , Tokyo , 2012 . 10.1109/LTB-3D.2012.6238097 [9] Hartzell A.L. , DaSilva M.G. , Shea H.R. , MEMS Reliability , Springer ( New...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410151
EISBN: 978-1-62708-280-8
... identify the isolated spots that are not in the feed path from the feeder. The casting geometry needs to be modified to open the feed path. Spot mold cooling by the chills embedded in the mold drives the gradients to eliminate the isolated hot spots. Chilling sets up steep temperature gradients to push...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smfpa.t53500133
EISBN: 978-1-62708-317-1
...Abstract Abstract Hot stamping is a forming process for ultrahigh-strength steels (UHSS) that maximizes formability while minimizing springback. This chapter covers several aspects of hot stamping, including the methods used, the effect of process variables, and the role of finite-element...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850060
EISBN: 978-1-62708-260-0
... Increase or decrease agitation Use better preparation Increase voltage and decrease time Stains on polished surface Attack after polishing current is off Remove specimen while current is still on Try less corrosive electrolyte Unpolished spots (bullseyes) Gas bubbles Increase agitation Decrease...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030247
EISBN: 978-1-62708-282-2
... and corresponding shear stress, Pa Stratified smooth Slug Annular wavy Moderate Extreme Straight pipe 3 100 200 10 Pipe with pitting 5 150 300 15 3D-bend 5 150 300 15 5 mm (0.2 in.) weld bead 10 350 700 25 Source: Ref 10 , 27 Typical local liquid wall...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.9781627082600
EISBN: 978-1-62708-260-0
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850165
EISBN: 978-1-62708-260-0
... using 4% picral (top left), 2% nital (top right), boiling alkaline sodium picrate (bottom left), and Klemm’s I tint etch after a light picral preetch (bottom right), 600×. Figure 3-38 Microstructure of warm-rolled hot-band steel (0.02C-0.13P-0.2Ti) etched with 2% nital (left...