This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.

This article presents methods that enable one to consistently, uniformly and quickly remove substrate silicon from units without imparting damage to the structure of interest. It provides examples of electron beam probing and backside nano-probing techniques. The electron beam probing techniques are E-beam Logic State Imaging, Electron-beam Signal Image Mapping, and E-beam Device Perturbation. Backside nano-probing techniques discussed include: Electron Beam Absorbed Current, Electron Beam Induced Resistance Change, four terminal resistance measurements, resistive gate defect identification, and circuit editing. The article also presents methods to prepare electron beam probing samples where some remaining silicon is required for the transistor functions and transmission electron microscope samples from units where the substrate silicon has been partially or completely removed.

This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.

This chapter covers the early studies and various discoveries by metals researchers to study the internal structure of metals. The topics covered include light microscopy, phase diagrams, X-ray diffraction, principles of precipitation hardening, and dislocation theory.

The overall chemical composition of metals and alloys is most commonly determined by x-ray fluorescence (XRF) and optical emission spectroscopy (OES). High-temperature combustion and inert gas fusion methods are typically used to analyze dissolved gases (oxygen, nitrogen, and hydrogen) and, in some cases, carbon and sulfur in metals. This chapter discusses the operating principles of XRF, OES, combustion and inert gas fusion analysis, surface analysis, and scanning auger microprobe analysis. The details of equipment set-up used for chemical composition analysis as well as the capabilities of related techniques of these methods are also covered.

The mechanical properties of steel are strongly influenced by the underlying microstructure, which is readily observed using optical microscopy. This chapter describes common room-temperature steel microstructures and how they are achieved via heat treatment. It discusses the production of hypo- and hypereutectoid steels and the effect of cooling rate on microstructure. It also examines quenched steels and the phase transformations associated with rapid cooling. It describes the development of lath and plate martensite, retained austenite, and bainite and how to identify the various phases. The chapter concludes with a brief review of spheroidized microstructures.

This chapter describes the various features of the metallurgical microscope. Key concepts are defined such as resolving power, the virtual image, bright- and dark-field illumination, numerical aperture, focal length, image contrast, depth of field, and spherical and chromatic aberration. Metallurgical microscope features such as apochromatic objectives, hyperplane oculars, vertical illuminators, counting reticles, widefield oculars, polarization filters, field diaphragms, interferometers, and tungsten-halogen lamps are explained. The optical system, nosepiece, types of objectives (the lens assembly close to the specimen) and eyepieces, and components of the illumination system are all explained. The last part of this chapter describes special procedures involved in using and calibrating the metallurgical microscope.

Several specialized instruments are available for the metallographer to use as tools to gather key information on the characteristics of the microstructure being analyzed. These include microscopes that use electrons as a source of illumination instead of light and x-ray diffraction equipment. This chapter describes how these instruments can be used to gather important information about a microstructure. The instruments covered include image analyzers, transmission electron microscopes, scanning electron microscopes, electron probe microanalyzers, scanning transmission electron microscopes, x-ray diffractometers, microhardness testers, and hot microhardness testers. A list of other instruments that are usually located in a research laboratory or specialized testing laboratory is also provided.

This chapter discusses the important aspects that a metallographer should understand in order to effectively reveal a microstructure. It begins by exploring etching response and how it can be a tool for revealing various microstructural features. The next part of the chapter discusses methods for revealing microstructure in the as-polished (unetched) specimen, then guidelines for selecting and using etchants when needed. The chapter discusses different types of etchants in terms of their ingredients, etching procedure, and major uses. The etchants discussed include basic etchants (nital and picral and their variations) and tint etchants for carbon and low-alloy steels and cast irons, and basic etchants for stainless steels. Finally, information is provided on different illumination methods (differential interference contrast and dark-field illumination) that can be used to highlight certain features in microstructures.

This chapter discusses the tools and techniques of light microscopy and how they are used in the study of materials. It reviews the basic physics of light, the inner workings of light microscopes, and the relationship between resolution and depth of field. It explains the difference between amplitude and optical-phase features and how they are revealed using appropriate illumination methods. It compares images obtained using bright field and dark field illumination, polarized and cross-polarized light, and interference-contrast techniques. It also discusses the use of photometers, provides best practices and recommendations for photographing structures and features of interest, and describes the capabilities of hot-stage and hot-cell microscopes.