There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main six methods used in semiconductor industry are: Auger spectroscopy, dynamic secondary ion mass spectroscopy, time of flight static secondary ion mass spectroscopy (ToF-SIMS), X-ray photoelectron spectroscopy, scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDX), and transmission electron microscope-EDX. This review specifically addresses ToF-SIMS and describes some typical examples of the application of Auger and SEM-EDX.

This article covers common techniques for surface characterization, including the modern scanning electron microscopy and methods for the chemical characterization of surfaces by Auger electron spectroscopy, X-ray photoelectron spectroscopy, and time-of-flight secondary ion mass spectrometry. The principles of surface analysis and some of the applications of the technique in polymer failure studies are also provided.

Process gas control for plasma (ion) nitriding is a matter of estimating the flows necessary to accomplish the required surface metallurgy. This chapter reviews several studies aimed at better understanding process gas control in plasma nitriding and its influence on compound zone formation. Emphasis is placed on the effect of sputtering on the kinetics of compound zone formation. The discussion covers the processes involved in process gas control analysis by photo spectrometry and mass spectrometry and the difficulties associated with gas analysis.