In the case of gearboxes, vibration is the primary mode of failure even at the mid-range of operating speeds. Avoiding such failures requires an understanding of gearbox design, vibration theory, and material properties. This chapter details sources and types of gearbox vibrations; characteristics of gearbox vibrations; fundamentals of periodic vibrations; and vibration theory. It provides housing design for single-stage offset parallel gearboxes, high-speed gearboxes, and epicyclic gearboxes. The chapter then provides an analysis and selection of design factors for vibration reduction. It presents five types of gear tooth geometry errors. The chapter also focuses on gear quality inspection and on bearing-induced vibrations.

This chapter focuses on the design of measuring devices. The devices used to measure vibration typically consist of an electronic transducer with an interconnecting cable and an alternating current voltmeter. The working principle of each type of transducer is described in this chapter along with their important characteristics and common applications. The chapter provides general guidelines for the selection of a measuring device, and discusses vibration severity levels.

The cyclic nature of gearbox vibration lends itself well to the analysis in the frequency domain where the effects of a gear mesh, bearing defects, and other sources of vibration are effectively set apart, making it much easier to identify and correct the underlying causes of vibration. This chapter presents spectral maps that show how gearbox vibrations change with the rotational speed of components. It then explains how to identify the sources of vibration in a high-speed gearbox. The chapter also discusses other errors including backlash, ghost frequencies, unbalance, misalignment, mechanical looseness, and index variation form errors. It also presents the calculation of gear frequencies on gearbox vibration spectra and the influence of operating conditions.

This chapter details the vibration limits for gearboxes. It focuses on critical speed and peak load. The chapter presents vibration measurement and analysis, which provides a quick and relatively inexpensive way to detect and identify mechanical problems before they become more serious and costly.

Gearbox vibrations are classified as synchronous or nonsynchronous depending on whether or not they are related to the rotational speed of an internal or connected component. This chapter presents a turbogenerator case study that demonstrates the source of nonsynchronous vibration. It then provides a detailed discussion on spiking vibrations and presents design improvement and reduction of spiking vibrations.

This chapter analyzes four gearbox failures, in each case identifying the underlying failure mechanism and recommending changes to reduce vibration. These include failure of an offset parallel gearbox due to gear tooth geometry error; high vibration on high-speed offset parallel gearbox; failure of an epicyclic gearbox; and vibration due to tooth wear.

This chapter presents guidelines for reducing gearbox vibration, with an emphasis on design factors that play major roles in influencing vibration.

Gearbox vibrations can often be dealt with in the field by modifying, replacing, and repositioning components and adjusting operating conditions and control parameters. Every gearbox design, however, eventually reaches a point where problems due to vibration are not so easily addressed. This chapter discusses such a case, that of an epicyclic reducer plagued by subsynchronous vibration, and explains how the gearbox was redesigned, improving lifetime as well as efficiency.

This appendix provides a list of books and technical papers utilized as reference material during the development of this book.

This chapter provides an overview of how the disciplines of design, material, and manufacturing contribute to engineering for functional performance. It describes the interaction of product designers and casting engineers in product development. It discusses the consequences of component failure, uncertainty in data and assumptions, and selection of the factor of safety. The chapter also presents an overview of the functional requirements for product performance and provides an overview of product design development. It also presents a partial list of the different tests that are performed on prototypes and examples of product testing. The chapter describes the requirements of a traceability system.

This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications. The article presents examples that demonstrate the benefits of the enhanced wafer-level FA process. It also introduces the setup of the wafer-level fault localization system. The application of the wafer-level FA process on a 22 nm technology device failing memory test is studied and some common design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

This chapter provides an outline of the failure modes and mechanisms associated with most boiler tube failures in coal-fired power plants. Primary categories include stress rupture failures, water-side corrosion, fire-side corrosion, fire-side erosion, fatigue, operation failures, and insufficient quality control.