This chapter assesses the benefits of using a solid immersion lens (SIL) to detect faults in ICs via optical imaging and laser-stimulation techniques. It discusses the advantages and limitations of different types of SILs and their effect on spatial resolution, spot size, focus depth, and collection efficiency. It also provides a brief overview of technical challenges at the die level.

An architectural shift to buried power rails (BPRs) with backside power delivery (BPD) is on the horizon as CMOS technology approaches the 2 nm node. The obstruction created by the presence of BPD networks obsoletes many of the electrical fault isolation (EFI) techniques that have been used for the past few decades and severely degrades the performance of others. This chapter provides an overview of EFI methods that are still applicable to ICs with BPD networks, including e-beam and atomic force probing, x-ray and magnetic field imaging, and lock-in thermography. It assesses the technical challenges of each method as well as the potential for improvement.

The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its microstructure in order to identify the root cause of failure. This chapter assesses the tools and techniques used for those purposes and the challenges brought on by continued transistor scaling, advanced 3D packages, and new IC architectures. The areas covered include sample preparation, nanoprobing, microscopy, FIB circuit edit, and scanning probe microscopy.

This chapter provides a brief introduction to manufacturing processes used to produce metal parts and how they differ in terms of achievable geometries, tolerances, surface finishes, and production rate.

This chapter reviews the current technology and examines force application systems, force measurement, strain measurement, important instrument considerations, gripping of test specimens, test diagnostics, and the use of computers for gathering and reducing data. The influence of the machine stiffness on the test results is also described, along with a general assessment of test accuracy, precision, and repeatability of modern equipment. The chapter discusses various types of testing machines and their operations. Emphasis is placed on strain-sensing equipment. The chapter briefly describes load condition factors, such as strain rate, machine rigidity, and various testing modes by load control, speed control, strain control, and strain-rate control. It provides a description of environmental chambers for testing and discusses the processes involved in the force verification of universal testing machines. Specimen geometries and standard tensile tests are also described.

Users of steel castings establish performance requirements for specific characteristics of the castings based on the planned use. They express tolerance for variation in those characteristics to the producer of the castings. One issue which should never be taken for granted in considering capability and tolerances is the ability to measure with accuracy and precision (repeatability and reproducibility). This chapter discusses the methods for measuring accuracy and precision. It describes the variation of process characteristics, capability indices in general use, and factors related to process performance and tolerance specification.