As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field analysis have proven the validity of using MFI for 3D FI and 3D current mapping. This article briefly discusses the fundamentals of the technique, paying special attention to critical capabilities like sensitivity and resolution, limitations of the standard technique, sensor requirements and, in particular, the solution to the 3D problem, along with examples of its application to real failures in devices.

Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.

After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. There are numerous techniques and technologies available for examining and analyzing components and subassemblies, which are categorized as follows: optical approaches, dimensional inspection and related approaches, nondestructive test approaches, mechanical and environmental approaches, and chemical and composition analysis for assessing material characteristics. This chapter is a detailed account of the working principle and the steps involved in these techniques and technologies.

This article focuses on characterization techniques used for analyzing the physical behavior and chemical composition of thermoset resins, namely chromatography and infrared spectroscopy. The main purpose is to give sufficient detail to permit the reader understand a particular test technique and its value to the thermoset resin field. Epoxy resins are emphasized in the examples because they dominate the airframe and aerospace industries. The article also provides information on two categories of characterization of the processing behavior of thermoset. The first studies the thermal properties of reactive thermoset systems, while the second utilizes these thermal characteristics as the basis for monitoring and control during processing.

This article addresses some established protocols in characterizing thermoplastics, whether they are homogeneous resins, alloyed or blended compositions, or highly modified thermoplastic composites. It begins with a description of various approaches used for the determination of molecular weight (MW) by viscosity measurements. This is followed by a discussion of the use of cone and plate and parallel plate geometries in determining the viscoelastic properties of a polymer melt. Details on some of the chromatographic techniques that allow determination of MW and MW distribution of polymers are then provided. The article concludes with information on three distinctive, but complementary operations of thermoanalytical techniques, namely differential scanning calorimetry, thermogravimetric analysis, and thermomechanical testing.

This article discusses electrical testing and recommended procedures for determining the electrical properties of insulating materials, with particular emphasis on plastics. It describes the electrical characteristics of various forms of plastics and also presents definitions of the terms used in connection with testing and specifying plastics for electrical applications.

This article is a brief account of various factors pertinent to the characterization of materials and analysis of optical components, namely transmission, haze, yellowness, refractive index, surface irregularity, birefringence, internal contamination, surface gloss, and color. In addition, details on ad hoc tests used for determining the acceptability of a plastic part for its application are provided, along with typical examples.

The mechanical properties of a material describe the relations between the stresses acting on the material and its resulting deformations. Stresses capable of producing permanent deformations, which remain after the stresses are removed, are considered in this chapter. The effects of cryogenic temperatures on the mechanical properties of metals and alloys are reviewed in this chapter; the effects on polymers and glasses are discussed briefly. The fundamental mechanisms controlling temperature-dependent mechanical behavior, phenomena encountered in low-temperature testing, and the mechanical properties of some representative engineering metals and alloys are described. Modifications of test procedures for low temperatures and sources of data are also included.