Phase diagrams serve as a map to the phases present in an alloy at different temperatures and compositions. They also help in assessing mechanical properties, selecting heat treat temperatures, warning of possible solidification problems, and identifying routes for creating desired microstructures. This chapter familiarizes readers with the information contained in binary phase diagrams and the methods used to extract it. It explains how thermocouple measurements are used to determine liquidus, solidus, and eutectic reaction lines, how differential scanning calorimetry shows where phase reactions occur, and how x-ray diffraction identifies the actual phases present. It demonstrates the use of tie lines for determining phase composition at different temperatures and the application of the level rule to calculate phase fractions. It also discusses the CALPHAD method and presents computed binary phase diagrams that account for the presence of inclusions, oxygen content, and secondary phases.

This chapter familiarizes readers with the basic theory of molecular dynamics and its application in the study of materials. It explains how material properties and behaviors are determined through the iterative calculation of motion equations for a collection of atoms under a given set of conditions. It also provides a walk-through on the use of LAMMPS, an open-source molecular dynamics simulator, discussing the selections and inputs of relevance to practical materials problems.

The appendix contains detailed simulation examples through which readers learn how to format and analyze problems using the LAMMPS molecular dynamics simulator. By means of simulation, readers will determine the thermal expansion coefficient of copper, generate stress-strain plots for aluminum at different temperatures, calculate the surface energy of copper for different crystal orientations, investigate diffusion effects in BCC iron, estimate the sliding friction between graphene layers, compare the stacking fault energy of silver and aluminum, and analyze the properties and behaviors of liquids and gases. All examples employ a systematic problem-solving approach and include necessary input code.

This chapter, presented in a question-and-answer format, covers many practical aspects of high-entropy alloys (HEAs). It provides clear and concise answers to more than 50 questions, imparting knowledge on alloying elements, heat treatments, diffusion mechanisms, phase formation, lattice distortion, crystal and grain structures, structure-property relationships, microstructure control, and characterization methods. It likewise explains how to calculate the effect of strengthening processes on the mechanical properties of HEAs and offers insights on how to balance strength, ductility, and density for specific applications. It also provides information on twinning behaviors, stacking faults, elastic properties, coating and film deposition methods, manufacturing challenges, and the use of computational techniques for alloy design.

Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor technology from design to manufacturing and the characterization methods are discussed. The focus is on two prominent MOS structures: planar MOS device and FinFET device. The article covers the device parameters and device properties that determine the design criteria and the device tuning procedures. The discussion includes the effects of drain induced barrier lowering, velocity saturation, hot carrier degradation, and short channel on these devices.

This article addresses the ancillary issues regarding the nanoprobing and characterization of transistors, probing copper metallization layers, and the various imaging techniques. The discussion includes several characterization examples of known transistor failure types, namely four probe transistor characterization, two probe transistor characterization, and probing and characterizing metallization issues. The imaging techniques discussed are those that are specific to atomic force nanoprober or scanning electron microscope based tools. They are current contrast imaging, scanning capacitance imaging, e-beam absorbed current imaging, e-beam induced current imaging, e-beam induced resistance change imaging, and active voltage contrast imaging.

This article presents methods that enable one to consistently, uniformly and quickly remove substrate silicon from units without imparting damage to the structure of interest. It provides examples of electron beam probing and backside nano-probing techniques. The electron beam probing techniques are E-beam Logic State Imaging, Electron-beam Signal Image Mapping, and E-beam Device Perturbation. Backside nano-probing techniques discussed include: Electron Beam Absorbed Current, Electron Beam Induced Resistance Change, four terminal resistance measurements, resistive gate defect identification, and circuit editing. The article also presents methods to prepare electron beam probing samples where some remaining silicon is required for the transistor functions and transmission electron microscope samples from units where the substrate silicon has been partially or completely removed.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

This article describes the most common, general-purpose analog design-for-test (DFT) methods, analog test buses and loopback, and shows their advantages and limitations in diagnosability and automatability. It also describes DFT and built-in self-test (BIST) techniques for the most common analog functions, namely phase-locked loop, serializer-deserializer, analog/digital converters, and radio frequency. Lastly, the challenges of creating BIST for analog functions are summarized, along with seven principles that must be exploited to meet these challenges. These principles show how the design constraints for analog BIST circuitry can be more relaxed than for the circuit under test, while delivering the required test accuracy and speed.

This chapter provides an overview of a computational method, called CALPHAD, used for the study of phase equilibria in multicomponent systems. It describes the thermodynamic models and calculation techniques employed in the software and explains how it applies to complex alloys used in industry. It also provides examples showing how CALPHAD has been used to determine the formability of metallic glass, calculate the dilation of stainless steel during phase transformation, and predict the beta transus and approach curves of commercial titanium alloys.

This appendix provides a brief introduction to Thermo-Calc, explains what it is, and lists its uses. Instructions for accessing a demonstration version of the software are also provided.

This chapter discusses the development and use of microstructure models for optimizing superalloy forging operations. It describes how the processes that control grain structure evolution during hot working were used in model formulation and compares predicted microstructures with experimental results.

This chapter provides an overview of factors that must be considered in the design of structural components for satisfactory service performance in terms of mechanical behavior of steel castings. The chapter discusses designing against yielding, excessive deflection, and creep and stress rupture. The chapter describes the three main approaches to evaluating and designing structures relative to fatigue resistance: the S-N curve approach for high cycle fatigue, the strain range approach for low cycle fatigue, and the fracture mechanics approach. Two approaches to design against brittle fracture are described, the ductile to brittle transition concept and the fracture mechanics approach. The chapter also discusses several types of corrosion behavior and emphasizes the need to interact with corrosion specialists in the design process. It illustrates the unique advantages that designers may gain by designing components as castings to achieve low stress concentrations economically.

This chapter explains various aspects of the foundry process that the design engineer should consider when designing steel castings. It discusses special feeding aids, such as tapers, padding, ribs, and chills that may be used by foundry personnel to promote directional solidification. The chapter addresses the design of castings to reduce the occurrence of internal shrinkage. It provides a detailed discussion on design considerations for molding, cleaning, machining, and function.

This chapter focuses on engineering drawings for casting production, providing information on machining and casting drawings and machining and tooling references.

Parts of machines and equipment that have previously been designed as wrought or fabricated parts, or as cast parts of metals other than steel, are often reconsidered as steel castings. This chapter presents bending test data for several junction designs of L and box sections and discusses redesign from fabrication, forgings, and cast iron. The chapter also includes the benefits of redesign.