This chapter presents the theory and practice associated with the application of thin films. The first half of the chapter describes physical deposition processes in which functional coatings are deposited on component surfaces using mechanical, electromechanical, or thermodynamic techniques. Physical vapor deposition (PVD) techniques include sputtering, e-beam evaporation, arc-PVD, and ion plating and are best suited for elements and compounds with moderate melting points or when a high-purity film is required. The remainder of the chapter covers chemical vapor deposition (CVD) processes, including atomic layer deposition, plasma-enhanced and plasma-assisted CVD, and various forms of vapor-phase epitaxy, which are commonly used for compound films or when deposit purity is less critical. A brief application overview is also presented.

This appendix provides a brief review of thin film deposition methods and their uses in a question and answer format. The questions deal with recommended practices, process conditions, terminology, and classifications.

With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.

This chapter describes surface modification processes that go beyond conventional heat treatments, including plasma nitriding, plasma carburizing, low-pressure carburizing, ion implantation, physical and chemical vapor deposition, salt bath coating, and transformation hardening via high-energy laser and electron beams. The chapter compares methods and includes several example applications.

This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.

Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. The chapter addresses this issue with a focus on soldering fluxes. The chapter also describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.

This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

This appendix contains a brief list of general references related to soldering technology.

This chapter describes the origins of solders and soldering, covering the composition of solders and applications of soldering.

Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.

This chapter presents abbreviations and symbols used for soldering.

Organic coatings (paints and plastic or rubber linings), metallic coatings, and nonmetallic inorganic coatings (conversion coatings, cements, ceramics, and glasses) are used in applications requiring corrosion protection. These coatings and linings may protect substrates by three basic mechanisms: barrier protection, chemical inhibition, and galvanic (sacrificial) protection. This chapter begins with a section on organic coating and linings, providing a detailed account of the steps involved in the coating process, namely, design and selection, surface preparation, application, and inspection and quality assurance. The next section discusses the methods by which metals, and in some cases their alloys, can be applied to almost all other metals and alloys: electroplating, electroless plating, hot dipping, thermal spraying, cladding, pack cementation, vapor deposition, ion implantation, and laser processing. The last section focuses on nonmetallic inorganic coatings including ceramic coating materials, conversion coatings, and anodized coatings.

Tool steels are the ferrous alloys used to manufacture tools, dies, and molds that shape, form, and cut other materials, including steels, nonferrous metals, and plastics. This chapter explores the considerations that make tool steels a very special class of steels, the long historical evolution of iron and steel manufacture, including steels for tools, and the development of tool steels as they emerged from the general class of iron and steel products.

The several specific grades or compositions of tool steels have evolved over time and have been organized into useful groupings. This chapter presents the AISI classification system for tool steels, which categorizes tool steels by their alloying, applications, or heat treatment, and briefly describes the characteristics of each major group. It discusses selection criteria for tool steels, along with examples.

This chapter describes some of the more typical manufacturing practices, along with their benefits and limitations. The manufacturing practices covered include primary melting, electroslag remelting, rolling, hot and cold drawing, and continuous casting. The chapter discusses the advance and application of powder metallurgy. A few of the more recently introduced processes that hold considerable promise for producing tool steels or finished tools at a lower cost or with improved quality also are reviewed.

This chapter describes the various phases that form in tool steels, starting from the base of the Fe-C system to the effects of the major alloying elements. The emphasis is on the phases themselves: their chemical compositions, crystal structures, and properties. The chapter also provides general considerations of phases and phase diagrams and the determination of equilibrium phase diagrams. It describes the formation of martensite, characteristics of alloy carbides, and the design of tool steels.

This chapter describes how the phases are arranged into desired microstructures during the heat treatment of tool steels. It describes the microstructural changes that are the objectives of the austenitizing, quenching, and tempering steps of tool steel hardening. The chapter covers austenite composition, retained austenite, and austenite grain size and grain growth. It provides information on the hardness and hardenability of tool steel. The chapter reviews some of these concepts and describes the microstructural appearance of the products of diffusion-controlled transformation of austenite. The role that diffusion-controlled phase transformations play relative to the hardenability of high-carbon and alloy tool steels is then emphasized. It presents general considerations of transformation diagrams, Jominy curves, and the hardenability of tool steels. The factors related to the kinetics and stabilization of martensite transformation are also covered. It briefly reviews selected aspects of the changes that evolve during tempering.