This chapter covers the mechanics and tribology of sheet metalworking processes, including shearing, bending, spinning, stretching, deep drawing, ironing, and hydroforming. It explains how to determine friction, wear, and lubrication needs based on process forces, temperatures, and strains and the effects of strain hardening on workpiece materials. It presents test methods for evaluating process tribology, describes lubrication and wear control approaches, and discusses the factors, such as surface roughness, lubricant breakdown, and adhesion, that can lead to galling and other forms of wear. It also provides best practices for selecting, evaluating, and applying lubricants for specific materials, including steels, stainless steels, and aluminum and magnesium alloys.

In contrast to most plastic deformation processes, the shape of a machined component is not uniquely defined by the tooling. Instead, it is affected by complex interactions between tool geometry, material properties, and frictional stresses and is further complicated by tool wear. This chapter covers the mechanics and tribology of metal cutting processes. It discusses the factors that influence chip formation, including tool and process geometry, cutting forces and speeds, temperature, and stress distribution. It reviews the causes and effects of tool wear and explains how to predict and extend the life of cutting tools based on the material of construction, the use of cutting fluids, and the means of lubrication. It presents various methods for evaluating workpiece materials, chip formation, wear, and surface finish in cutting processes such as turning, milling, and drilling. It also discusses the mechanics and tribology of surface grinding and other forms of abrasive machining.

This chapter provides basic concepts and background for customer-related manufacturing processes applied to aluminum products including forming, joining and welding, surface treatments, and machinability. It reviews the selection criteria, key testing regimes, and original equipment manufacturer (OEM) requirements. The chapter also presents examples that demonstrate the importance of choosing the correct alloy and temper to successfully meet the OEM fabrication criteria.

This chapter provides details on several specific binder formulations and a discussion of basic binder design concepts. The focus is on customization of the feedstock response to heating, pressurization, or solvent exposure for a specific shaping process. The discussion starts with the requirements of a binder system, the historical progression of binder formulations, and the use of binder alternatives to adapt to specific applications. The importance of binder handling strength to shape preservation is emphasized. The chapter provides information on the binders used for room-temperature shaping, namely slurry and tape casting systems.

The conversion of feedstock into a shape involves the application of heat and pressure, and possibly solvents. This chapter discusses the operating principle, advantages, limitations, and applications of such shaping processes, namely additive manufacturing, cold isostatic pressing, die compaction, extrusion, injection molding, slip casting, slurry processes, and tape casting. Information on equipment setup, requirements, and the various factors influencing these processes are described. In addition, the chapter provides information on novel approaches and processing costs applicable to these shaping processes.

Binder removal approaches involve various combinations of heat, solvents, vacuum, and pressure. In each variant, the goal is binder removal without component damage. This chapter addresses the factors that control success, showing how process decisions depend on the powder and binder characteristics. The chapter starts with a comparison of binder-, lubricant-, and polymer-removal situations that arise after powder shaping and then describes the general principles of binder removal in powder-binder techniques. The subsequent sections discuss in detail characteristics, operating procedure, equipment setup, advantages, limitations, and applications of first- and second-stage binder removal processes, as well as the factors influencing these processes. Cost issues associated with binder-removal technologies are also discussed.

This chapter provides details on powder-binder processing for three materials, namely precipitation-hardened 17-4 PH stainless steel, cemented carbides, and alumina. The types of powders, binders, feedstock, shaping processes, debinding, sintering cycles, compositions, microstructure, distortion, postsintering treatments, and mechanical properties are presented for each. The shaping options include powder-binder approaches such as binder jetting, injection molding, extrusion, slip and slurry casting, centrifugal casting, tape casting, and additive manufacturing. Sintering options are outlined with respect to attaining high final properties.

The orientation of the devices within a package determine the best chosen approach for access to a select component embedded in epoxy both in package or System in Package and multi-chip module (MCM). This article assists the analyst in making decisions on frontside access using flat lapping, chemical decapsulation, laser ablation, plasma reactive ion etching (RIE), CNC based milling and polishing, or a combination of these coupled with optical or electrical endpoint means. This article discusses the general characteristics, advantages, and disadvantages of each of these techniques. It also presents a case study illustrating the application of CNC milling to isolate MCM leakage failure.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.

This chapter familiarizes readers with the machining characteristics of titanium and the implementation of machining and shaping processes. It explains why titanium alloys are more difficult to machine than other metals and how it impacts the equipment and procedures that can be used. It describes the basic machining requirements for titanium in terms of tool geometry and materials, machine setup rigidity, cutting speeds and feed rates, and surface conditions, and explains how the requirements are met in practice in milling, turning, drilling, surface grinding, and broaching operations. The chapter also covers chemical and electrochemical machining processes as well as flame cutting.

This chapter describes sheet metal forming operations, including cutting, blanking, piercing, and bending as well as deep drawing, spinning, press-brake and stretch forming, fluid forming, and drop hammer and electromagnetic forming. It also discusses the selection and use of die materials and lubricants along with superplastic forming techniques.

This chapter covers the practical aspects of machining, particularly for turning, milling, drilling, and grinding operations. It begins with a discussion on machinability and its impact on quality and cost. It then describes the dimensional and surface finish tolerances that can be achieved through conventional machining methods, the mechanics of chip formation, the factors that affect tool wear, the selection and use of cutting fluids, and the determination of machining parameters based on force and power requirements. It also includes information on nontraditional machining processes such as electrical discharge, abrasive jet, and hydrodynamic machining, laser and electron beam machining, ultrasonic impact grinding, and electrical discharge wire cutting.

This chapter covers a wide range of finishing and coating operations, including cleaning, honing, polishing and buffing, and lapping. It discusses the use of rust-preventative compounds, conversion coatings, and plating metals as well as weld overlay, thermal spray, and ceramic coatings and various pack cementation and deposition processes. It also discusses the selection and use of industrial paints and paint application methods.

This chapter discusses the causes and effects of wear along with prevention methods. It covers abrasive, erosive, erosion-corrosion, grinding, gouging, adhesive, and fretting wear. It also discusses various forms of contact-stress fatigue, including subsurface-origin fatigue, surface-origin fatigue, subcase-origin fatigue (spalling fatigue), and cavitation fatigue.