This chapter provides an introduction to induction soldering. It also illustrates the classification of the different soldering processes according to the heat source, as described in the German standard, Soldering: Categorization of Processes According to Energy Sources, Process Descriptions.

This chapter presents a brief review of the history of brazing and soldering. It illustrates complicated soldering techniques and masterful goldsmith work, as demonstrated by the famous gold mask of the Egyptian Pharaoh Tutankhamun. The chapter includes the image of a painting from Egypt circa 1475 B.C. that shows a goldsmith soldering with a blowpipe. Numerous similar images have been found in the tombs of ancient Egypt that offer insight into the practices of gold workers from the period, including the use of processes such as smelting, forging, and joining with both brazing and soldering.

This chapter explains the fundamentals of soldering technology and provides an overview of the soldering process. It discusses the wetting of the molten solder filler metal to the base material surface and the design aspects when induction heating is used to make the solder joint.

This chapter presents the following groupings of metals and alloys that are soldered together: steel and iron-base alloys, aluminum and aluminum alloys, and copper and copper alloys. It also presents the ancillary materials and process methods that assist the solder filler metal in completing the solder joint through induction heating. The chapter focuses on the selection of fluxes and the use of inert gases or even vacuum to realize an oxide-free base material surface both before and during the soldering process.

This chapter details various induction soldering processes, including soldering with manually fed solder, soldering with filler metal (preplaced) preforms, soldering with solder coating, and soldering with an automated solder wire feeder.

This chapter focuses on factors that influence the mechanical properties of a soldered joint, including solder material, base material, solder joint design, soldering surface, soldering temperature, and test methodology.

This chapter describes important aspects of the interrelationship between the workpiece and the inductor coil, an understanding of which is essential for achieving an efficient soldering process and a solder joint with the desired performance and reliability. It also discusses induction soldering machine operation parameters, including temperature measurement and control sensors. The chapter illustrates the equipment used in a fully automated induction heating system. Fully automated soldering systems include temperature monitoring devices to control the temperature-time profile, the movement of workpieces, the supply of solder filler metal and flux, and the provision of shielding gas in the solder joint area.

This chapter explores case studies on using induction heating for joining applications, encompassing both soldering and brazing to demonstrate versatility. Each study focuses on inductor coil design, workpiece geometry, and production quantities, emphasizing optimization due to the interplay between material geometry, coil configuration, and process parameters like generator frequency and power. The case studies provide real-world data on effectively implementing induction heating in joining processes.

This chapter discusses the critical soldering faults that lead to quality degradation and potential failure of a soldered connection. It then describes the types of nondestructive evaluations used to inspect soldered and brazed joints, including dimensional and visual inspection, ultrasonic testing, radiographic examination, dye penetrant inspection, and leak testing, including overpressure tests. The chapter also provides an overview of destructive physical analysis.

This chapter describes the general hazards of induction heating and the hazards that are specific to induction joining processes. It also includes a brief discussion of economic considerations in the use of induction soldering.

This appendix presents the United States, German and European soldering and brazing standard specifications.

Joining comprises a large number of processes used to assemble individual parts into a larger, more complex component or assembly. The selection of an appropriate design to join parts is based on several considerations related to both the product and the joining process. Many product design departments now improve the ease with which products are assembled by using design for assembly (DFA) techniques, which seek to ensure ease of assembly by developing designs that are easy to assemble. This chapter discusses the general guidelines for DFA and concurrent engineering rules before examining the various joining processes, namely fusion welding, solid-state welding, brazing, soldering, mechanical fastening, and adhesive bonding. In addition, it provides information on several design considerations related to the joining process and selection of the appropriate process for joining.

Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.

Beryllium has been successfully joined by fusion welding, brazing, solid-state bonding, and soldering. This chapter describes these processes in detail along with their advantages and disadvantages. It also addresses application considerations such as surface preparation, joint design, and testing.

Brazing and soldering jointly represent one of several methods for joining solid materials. This chapter summarizes the principal characteristics of the various joining methods. It then discusses key parameters of brazing including surface energy and tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials, new phase formations, significance of the joint gap, and the strength of metals. The chapter also describes issues in processing aspects that must be considered when designing a joint, and the health, safety, and environmental aspects of brazing.

This chapter describes the origins of solders and soldering, covering the composition of solders and applications of soldering.

Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.

Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. The chapter addresses this issue with a focus on soldering fluxes. The chapter also describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.