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Diffusion bonding
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550511
EISBN: 978-1-62708-307-2
Abstract
Ceramics normally have high melting temperatures, excellent chemical stability and, due to the absence of conduction electrons, tend to be good electrical and thermal insulators. They are also inherently hard and brittle, and when loaded in tension, have almost no tolerance for flaws. This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process.
Book Chapter
Book: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
Abstract
Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.