A working knowledge of diffusion is necessary to understand and predict the behavior of metals and alloys during manufacturing and in certain types of service. This chapter covers the fundamentals of diffusion in solids and some of the applications in which diffusion plays a role. It discusses the mechanisms behind interstitial, substitutional, grain boundary, and surface diffusion, the derivation and use of Fick’s laws, and the basic principles of diffusion coating processes, including carburizing, nitriding, nitrocarburizing, cyaniding, carbonitriding, boriding, aluminizing, siliconizing, chromizing, vanadizing, and titanizing. It also discusses diffusion bonding and presents several approaches for dealing with oxide barrier problems.

Ceramics normally have high melting temperatures, excellent chemical stability and, due to the absence of conduction electrons, tend to be good electrical and thermal insulators. They are also inherently hard and brittle, and when loaded in tension, have almost no tolerance for flaws. This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process.

Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.