This chapter presents the theory and practice associated with the application of thin films. The first half of the chapter describes physical deposition processes in which functional coatings are deposited on component surfaces using mechanical, electromechanical, or thermodynamic techniques. Physical vapor deposition (PVD) techniques include sputtering, e-beam evaporation, arc-PVD, and ion plating and are best suited for elements and compounds with moderate melting points or when a high-purity film is required. The remainder of the chapter covers chemical vapor deposition (CVD) processes, including atomic layer deposition, plasma-enhanced and plasma-assisted CVD, and various forms of vapor-phase epitaxy, which are commonly used for compound films or when deposit purity is less critical. A brief application overview is also presented.

This appendix provides a brief review of thin film deposition methods and their uses in a question and answer format. The questions deal with recommended practices, process conditions, terminology, and classifications.

A working knowledge of diffusion is necessary to understand and predict the behavior of metals and alloys during manufacturing and in certain types of service. This chapter covers the fundamentals of diffusion in solids and some of the applications in which diffusion plays a role. It discusses the mechanisms behind interstitial, substitutional, grain boundary, and surface diffusion, the derivation and use of Fick’s laws, and the basic principles of diffusion coating processes, including carburizing, nitriding, nitrocarburizing, cyaniding, carbonitriding, boriding, aluminizing, siliconizing, chromizing, vanadizing, and titanizing. It also discusses diffusion bonding and presents several approaches for dealing with oxide barrier problems.

This chapter familiarizes readers with the use of Fick’s laws of diffusion in heat treating, coating, and other metallurgical processes. It contains worked solutions to nearly 30 problems requiring the calculation of activation energy, diffusion coefficient, concentration level, surface layer thickness, case depth, and processing time and temperature. The selected problems deal with various types of iron, steel, and nonferrous alloys and processes ranging from aluminizing, chromizing, carburizing, and plasma nitriding to hydrogen dissipation, decarburizing, and oxidation. A few diffusion problems involving single-crystal silicon are also included.

This article provides a brief description of commercially important thermal spray processes and gives examples of applications and application requirements. The processes covered are flame, wire arc, plasma, high-velocity oxyfuel processes, detonation gun, and cold spray methods. Examples are provided of the applications in aerospace, automotive, and medical device industries as well as the use of thermal spray as an additive manufacturing technique.

This article summarizes the results of work completed by the ASM Thermal Spray Society Advisory Committee to identify key research challenges and opportunities in the thermal spray field. It describes and prioritizes research priorities related to emerging process methods, thermal spray markets and applications, and process robustness, reliability, and economics.

This article presents best practices for the metallographic preparation of specimens produced via thermal spray coating methods. It outlines typical metallographic preparation process flow, highlighting important considerations for obtaining a clear and representative specimen suitable for characterization via examination techniques, such as optical or electron microscopy. The process flow includes preliminary resin infiltration, sectioning, mounting, grinding, and polishing. To aid in the identification and resolution of common issues during subsequent specimen analysis, the article presents common issues, along with causes and mitigation strategies. It describes the processes involved in the interpretation of the thermal spray coating microstructure.

Thermal barrier coatings (TBCs) are applied using thermal spray coating (TSC) processes to components that are internally cooled and operated in a heated environment. The TSC microstructures are prone to interactions with common metallographic procedures that may result in artifacts and misinterpretation of the TSC microstructure. This article aims to aid in identifying metallographic TSC artifacts, specifically in the air plasma spray zirconia-based TBC, including both of its common constituents, the bond coating and the top coating. Artifacts that result from specific sectioning and mounting practices, as well as from different polishing times, are presented. Additionally, the article discusses the factors in optical microscopy and scanning electron microscopy that affect microstructure interpretation.

Abradable coatings (such as Ni-4Cr-4Al/bentonite) are used throughout jet engines, primarily as sacrificial coatings into which moving components wear. This article presents the Accepted Practice for sample preparation of abradable coatings for metallographic analysis, based on round robin testing by several laboratories.

Molybdenum thermal spray coatings are used in aerospace and other industries for wear resistance applications. Metallographic sample preparation of molybdenum coatings presents unique challenges. The purpose of the investigation described in this article is to determine Accepted Practices for sample preparation to better understand the process related microstructures of thermal spray molybdenum powders. The committee followed a round robin approach to assess metallographic sample preparation by a variety of laboratories. The article summarizes the results of the committee’s work.

This article, prepared under the auspices of the ASM Thermal Spray Society Committees on Accepted Practices, describes a procedure for evaluating residual stresses in thermal spray coatings, which is an extension of the well-known layer removal method to include the Young’s modulus and Poisson’s ratio properties of the thermal spray coating material and the substrate. It presents questions and answers that were selected to introduce residual stresses in thermal spray coatings. The article describes equipment and the laboratory procedure for the modified layer removal method and provides the description of the residual stress specimen. It also describes the procedures for applying or installing bonded resistance strain gages, the dimensions of the test specimen, the procedure for removing layers, and the method for interpreting the data to evaluate residual stresses. The spreadsheet program, “ MLRM for Residual Stresses ,” is available as a supplement to this document.

This chapter, presented in a question-and-answer format, covers many practical aspects of high-entropy alloys (HEAs). It provides clear and concise answers to more than 50 questions, imparting knowledge on alloying elements, heat treatments, diffusion mechanisms, phase formation, lattice distortion, crystal and grain structures, structure-property relationships, microstructure control, and characterization methods. It likewise explains how to calculate the effect of strengthening processes on the mechanical properties of HEAs and offers insights on how to balance strength, ductility, and density for specific applications. It also provides information on twinning behaviors, stacking faults, elastic properties, coating and film deposition methods, manufacturing challenges, and the use of computational techniques for alloy design.

This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.

Cold spray is a process technology that, for the first time, enables the rapid deposition of a wide range of metals and some other materials in the solid state at temperatures far below their melting points. This chapter provides an overview of the processes involved in cold spray process technologies, namely high-pressure cold spray (HPCS) and low-pressure cold spray (LPCS), explaining differences of LPCS from HPCS. It summarizes the historical background of the cold spray process. The growing international interest in the cold spray process from the early 2000s is also reviewed.

This chapter reviews the current understanding of high-pressure cold spraying for different materials, covering widely accepted general mechanisms for particle deposition and the processes and parameters involved. It begins by reviewing the mechanisms of bonding. An overview of the optimization of the critical process parameters for improving coating qualities is then provided. This is followed by a separate section dealing with bonding between different materials and addressing influences on adhesion to the substrate as well as the cohesion between dissimilar coating constituents. The knowledge of the basic science and mechanisms finally allows for discussion on the requirements for suitable cold spray equipment and of the parameter sets needed for successful coating deposition.

The modeling and simulation activities in the field of high-pressure cold spray can be divided into two main parts: solid mechanics and fluid dynamics. This chapter focuses on these parts of modeling work in cold spray research. The discussion covers the objective, principal concepts, methods, and outcome of modeling and simulation of particle impact and of in-flight history of particles in cold spraying. The concept of integration of particle impact and fluid flow modeling to optimize cold spray deposition for a given material is also explained.