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Lead alloys
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420087
EISBN: 978-1-62708-310-2
Abstract
This chapter begins by presenting a generic eutectic phase diagram and identifying critical points, lines, and features. It then describes the composition and properties of aluminum-silicon and lead-tin eutectic systems, the characteristics of eutectic morphologies, the solidification and scale of eutectic structures, and the competitive growth of dendrites and eutectic colonies or cells. It also examines the different types of precipitation structures that form during slow cooling cycles.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.t69980009
EISBN: 978-1-62708-342-3
Abstract
The hot-working process extrusion is used to produce semifinished products in the form of bar, strip, and solid sections, as well as tubes and hollow sections. The first part of this chapter describes the composition, properties, and applications of tin and lead extruded products with a deformation temperature range of 0 to 300 deg C and magnesium and aluminum extruded products with a working temperature range of 300 to 600 deg C. The second part focuses on copper alloy extruded products, extruded titanium alloy products, and extruded products in iron alloys with a working temperature range of 600 to 1300 deg C.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170528
EISBN: 978-1-62708-297-6
Abstract
This article examines the role of alloying in the production and use of lead and tin. It describes the various categories and grades of lead and lead-base alloys along with their nominal compositions and corresponding UNS numbers. It also discusses the composition and properties of lead used in battery grids, type metals, and bearings. It, likewise, discusses the use of tin in various types of solder and in bearings and provides composition and property data for application-specific designations and grades. The article also discusses the effect of impurities in tin-lead solders and the amounts and combinations in which they are found.