Compared with other deformation processes used to produce semifinished products, the hot-working extrusion process has the advantage of applying pure compressive forces in all three force directions, enhancing workability. The available variations in the extrusion process enable a wide spectrum of materials to be extruded. This chapter focuses on the processes involved in the extrusion of semifinished products in various metals and their alloys, namely tin, lead, lead-base soft solders, tin-base soft solders, zinc, magnesium, aluminum, copper, titanium, zirconium, iron, nickel, and powder metals. It discusses their properties and applications as well as suitable equipment for extrusion. It further discusses the processes involved in the extrusion of semifinished products in exotic alloys and extrusion of semifinished products from metallic composite materials.

Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.

This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.

Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. The chapter addresses this issue with a focus on soldering fluxes. The chapter also describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

This chapter describes the origins of solders and soldering, covering the composition of solders and applications of soldering.

This article examines the role of alloying in the production and use of lead and tin. It describes the various categories and grades of lead and lead-base alloys along with their nominal compositions and corresponding UNS numbers. It also discusses the composition and properties of lead used in battery grids, type metals, and bearings. It, likewise, discusses the use of tin in various types of solder and in bearings and provides composition and property data for application-specific designations and grades. The article also discusses the effect of impurities in tin-lead solders and the amounts and combinations in which they are found.