Product design requires an understanding of the mechanical properties of materials, much of which is based on tensile testing. This chapter describes how tensile tests are conducted and how to extract useful information from measurement data. It begins with a review of the different types of test equipment used and how they compare in terms of loading force, displacement rate, accuracy, and allowable sample sizes. It then discusses the various ways tensile measurements are plotted and presents examples of each method. It examines a typical load-displacement curve as well as engineering and true stress-strain curves, calling attention to certain points and features and what they reveal about the test sample and, in some cases, the cause of the behavior observed. It explains, for example, why some materials exhibit discontinuous yielding while others do not, and in such cases, how to determine when yielding begins. It also explains how to determine other properties via tensile tests, including ductility, toughness, and modulus of resilience.

This appendix provides readers with worked solutions to 25 problems involving calculations associated with tensile testing and the determination of mechanical properties and variables. The problems deal with engineering factors and considerations such as stress and strain, loading force, sample lengthening, and machine stiffness, and with mechanical properties and parameters such as elastic modulus, Young’s modulus, strength coefficient, strain-hardening exponent, and modulus of resilience. They also cover a wide range of materials including various grades of aluminum and steel as well as iron, titanium, brass, and copper alloys.

This chapter discusses the effect of friction in the context of design. It explains how friction coefficients are determined and how they are used to make sizing and selection decisions. It covers practical issues associated with rolling friction, the use of lubricants, and the tribology of metal, ceramic, and polymer surfaces in contact. It also discusses the nature of rolling friction and provides helpful design guidelines.

This chapter discusses the processes and procedures involved in tribotesting, the significance of test parameters and conditions, and practical considerations including test metrics and measurements and the interpretation of wear damage. It also describes the different types of erosion tests in use and common approaches for adhesive wear and abrasion testing.

The chapter covers various aspects of biotribology in the context of dental care, orthopedic implants, haptics, eyewear, and stents and fixation devices. It also addresses the issue of biocompatibility and the effects of friction and contact pressure on skin.

This chapter provides guidelines and insights on the selection of materials, coatings, and treatments for friction and wear applications. It begins with a review of the system nature of tribological effects, the subtleties of friction, and the selection idiosyncrasies of the material systems and lubricants covered in prior chapters. It then presents a systematic approach for selecting tribomaterials, using an automotive fan motor as an example.

The hardenability of steel is governed almost entirely by the chemical composition (carbon and alloy content) at the austenitizing temperature and the austenite grain size at the moment of quenching. This article introduces the methods to evaluate hardenability and the factors that influence steel hardenability and selection. The discussion covers processes involved in Jominy end-quench test for evaluating hardenability. The effect of carbon on hardenability data and the effect of alloys on hardenability during quenching and on the tempering response (after hardening) are also discussed. In addition, the article provides information on the hardenability limits of H-steels after a note on hardenability correlation curves and Jominy equivalence charts.

When a material is sintered and evaluated for performance, the primary focus is on mechanical properties. This chapter discusses structural properties for representative materials. Some guidelines are presented on the types of tests and how property values depend on the testing procedure. Mechanical hardness and strength tabulations are provided to document sintered properties.

This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications. The article presents examples that demonstrate the benefits of the enhanced wafer-level FA process. It also introduces the setup of the wafer-level fault localization system. The application of the wafer-level FA process on a 22 nm technology device failing memory test is studied and some common design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small details. It begins with the basic microscope column and construction. The article discusses microscope adjustments, brightfield and darkfield illumination, and microscope concepts important to liquid crystal techniques. It also discusses solid immersion lenses, infrared and ultraviolet microscopy and concludes with laser microscopy techniques such as thermal induced voltage alteration and external induced voltage alteration.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.

Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field analysis have proven the validity of using MFI for 3D FI and 3D current mapping. This article briefly discusses the fundamentals of the technique, paying special attention to critical capabilities like sensitivity and resolution, limitations of the standard technique, sensor requirements and, in particular, the solution to the 3D problem, along with examples of its application to real failures in devices.

Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.