Leading Edge Technologies: Backside Power Delivery
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Published:2023
Abstract
An architectural shift to buried power rails (BPRs) with backside power delivery (BPD) is on the horizon as CMOS technology approaches the 2 nm node. The obstruction created by the presence of BPD networks obsoletes many of the electrical fault isolation (EFI) techniques that have been used for the past few decades and severely degrades the performance of others. This chapter provides an overview of EFI methods that are still applicable to ICs with BPD networks, including e-beam and atomic force probing, x-ray and magnetic field imaging, and lock-in thermography. It assesses the technical challenges of each method as well as the potential for improvement.
William Lo, Tom Xianghong Tong, Leading Edge Technologies: Backside Power Delivery, Electronic Device Failure Analysis Technology Roadmap, By Electronic Device Failure Analysis Society, ASM International, 2023, p 91–108, https://doi.org/10.31399/asm.tb.edfatr.t56090091
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