Systems-Level: Development and Challenges of Solid Immersion Lens
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Published:2023
Abstract
This chapter assesses the benefits of using a solid immersion lens (SIL) to detect faults in ICs via optical imaging and laser-stimulation techniques. It discusses the advantages and limitations of different types of SILs and their effect on spatial resolution, spot size, focus depth, and collection efficiency. It also provides a brief overview of technical challenges at the die level.
Zhongling Qian, Christof Brillert, Systems-Level: Development and Challenges of Solid Immersion Lens, Electronic Device Failure Analysis Technology Roadmap, By Electronic Device Failure Analysis Society, ASM International, 2023, p 83–90, https://doi.org/10.31399/asm.tb.edfatr.t56090083
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