Laser-Based, Photon, and Thermal Emission
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Published:2023
Abstract
This chapter assesses the capabilities and limitations of electric fault isolation (EFI) technology, the measurement challenges associated with new device architectures, and the pathways for improvement in emission microscopy, laser stimulation, and optical probing. It also assesses the factors that influence signal strength, spatial and timing resolution, and alignment accuracy between signal response images and the physical layout of the IC.
Venkat Krishnan Ravikumar, Kristofor Dickson, Christian Boit, Laser-Based, Photon, and Thermal Emission, Electronic Device Failure Analysis Technology Roadmap, By Electronic Device Failure Analysis Society, ASM International, 2023, p 3–19, https://doi.org/10.31399/asm.tb.edfatr.t56090003
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