Electronic Device Failure Analysis Technology Roadmap

Electronic Device Failure Analysis Technology Roadmap examines the trends shaping the future of semiconductor technology as well as the tools and techniques that will be required to detect, analyze, and remediate failures. The information is organized into ten chapters, seven of which assess the capabilities, limitations, and future needs of fault isolation technology in light of continued transistor scaling, increasing package complexity, and emerging IC architectures. Other chapters assess the tools and techniques used in die-level post-isolation failure analysis and the opportunities and challenges related to 3D packaging technology. The book also includes a chapter summarizing the technology gaps identified in previous chapters.