Microelectronics Failure Analysis: Desk Reference
Microelectronics Failure Analysis, Desk Reference, Seventh Edition offers the latest information on advanced failure analysis tools and techniques, illustrated with real-life examples. This book includes information to help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Topics include: Failure Analysis Process and Management, including wafer, package, and board level failure analysis flow; Incoming Inspection Tools, including optical, x-ray, and scanning acoustic microscopy; Fault Isolation, including front and backside sample preparation, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermography, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT, and current imaging; Device and Circuit Characterization, including scanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing; FIB Technique and Circuit Edit, including FIB overview and advanced circuit edit for first silicon debug; Physical Analysis, including deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron microscopy (TEM), and scanning probe microscopy; Memory FA, including DRAM, semiconductor memory failure signature analysis; Special Applications, including automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics; and Fundamental Topics, including integrated circuit testing, analog design, reliability, quality, and training. For information on the print version, ISBN: 978-1-62708-245-7, follow this link.
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