Acoustic Microscopy of Semiconductor Packages
The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.
Cheryl D. Hartfield, Thomas M. Moore, Sebastian Brand, Acoustic Microscopy of Semiconductor Packages, Microelectronics Failure Analysis: Desk Reference, 7th ed., Edited By Tejinder Gandhi, ASM International, 2019, p 67–100, https://doi.org/10.31399/asm.tb.mfadr7.t91110067
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