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Yi Che
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Proceedings Papers
ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 31-34, November 1–5, 2015,
Abstract
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It is difficult to localize the soft defect on analog and mixed-signal ICs only by OBIRCH, because OBIRCH laser scanning module could not synchronize with the IC under functional test, and the failure modes on analog and mixed-signal ICs are complicated. In this paper, a dynamic synchronization method is proposed to localize the soft defect precisely only with an OBIRCH tool on analog and mixed-signal ICs. The methodology and system configuration are presented. A case is studied successfully on an analog and mixed-signal IC using this method.
Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 184-188, November 9–13, 2014,
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Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.
