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Yangyang Sun
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Proceedings Papers
ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 135-139, November 15–19, 2009,
Abstract
View Papertitled, Near-Infrared Microscopy in Semiconductor Failure Analysis Applications
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for content titled, Near-Infrared Microscopy in Semiconductor Failure Analysis Applications
There has been ample discussion concerning the use of near infrared microscopy (NIR) in fields such as medical, materials science, and more recently in applications aimed toward micro-electro-mechanical systems (MEMS); however, little attention has been paid to the application of NIR microscopy in the verification and failure analysis of semiconductor memory devices. This paper will present a discussion of NIR and laser scanning confocal near-infrared microscopy, sample preparation for NIR microscopy, and emphasize examples of laser scanning confocal NIR microscopy in the measurement and failure analysis of silicon samples typical to the semiconductor industry.