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Y. Dai
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Proceedings Papers
ITSC 2007, Thermal Spray 2007: Proceedings from the International Thermal Spray Conference, 452-456, May 14–16, 2007,
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Two kinds of thermal barrier coatings with NiCoCrAlY bond coatings (BCs) deposited by electron beam-physical vapor deposition (EB-PVD) and high velocity oxy-fuel thermal spraying (HVOF), respectively, as well as their top 8wt.%Y 2 O 3 -ZrO 2 (YSZ) ceramic layers deposited in one batch by EB-PVD were prepared on near-α titanium alloys. The field emission scanning electronic microscopy and microhardness indentation are used in comparatively study of microstructures, microhardness of samples. Cracking modes and crack characteristics in TBCs are investigated after thermal cycling in atmosphere, along with the discussion of roles of residual stresses, bonding strengths and mechanical properties of bond coatings in different failure extents. It is found that morphologies of BCs deposited by different methods (EB-PVD and HVOF) result in the different microstructures and microhardness of their upper YSZ. The denser and more homogeneous BC prepared by EB-PVD leads to the YSZ with finer and denser columnar clusters and higher microhardness, and the inhomogeneous and porous latter results in the upper YSZ with coarser and loosely bonded columnar grains and lower microhardness, and the TBC with BC deposited by EB-PVD is more protective, which is synthetically induced by residual stresses, bonding strengths and mechanical properties of bond coatings.
Proceedings Papers
ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 431-435, November 11–15, 2001,
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Process development usually has an indispensable period of yield-learning. The length of the period is highly dependent on identification of the root causes of yield-limiting defects and thus failure analysis plays an important role in the yield improvement process. This paper presents the failure analysis of yield-limiting defects in 0.15µm process development. The failure analysis involves failure mode categorization by MOSAID tester, defective contact identification by contact-level Passive Voltage Contrast (PVC) technique and subsequent Focus Ion Beam (FIB) cross-section followed by Transmission Electron Microscopy (TEM) analysis. Finally, the root causes for the yield-limiting defects were identified.