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Wu Jia Jun
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Proceedings Papers
ISTFA2024, ISTFA 2024: Conference Proceedings from the 50th International Symposium for Testing and Failure Analysis, 320-326, October 28–November 1, 2024,
Abstract
View Papertitled, A Comprehensive Approach for Post Silicon Unique Hold Time Violation Debug on Ethernet Interface Issue
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for content titled, A Comprehensive Approach for Post Silicon Unique Hold Time Violation Debug on Ethernet Interface Issue
Unique frequency dependent hold time violation debug seen on Ethernet IP that caused at least 50% yield loss is showcased in this paper. This debug exposed the process variation issue seen, limitation in current FPGA timing sign-off methodology and design limitation that led to this rare hold time behavior. Customized ATPG patterns has become de facto for effective HVM screening including exploration of new path hold time fault pattern generation. The debug was backed by tester level and system validation debug with help from optical probing and FIB to confirm the root cause and silicon fixes required.
Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 190-193, November 12–16, 2023,
Abstract
View Papertitled, Effective Fault Localization Approach for High Speed Transceiver Failure: From Non-destructive to Destructive
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for content titled, Effective Fault Localization Approach for High Speed Transceiver Failure: From Non-destructive to Destructive
It has been a challenge to perform failure analysis for miniaturization of process node technology in high-speed transceiver. Failure analysis plays an important role in root cause analysis to enable R&D, product quality & reliabily improvement. This paper demonstrated an effective FA approach on a real case with ADPLL functional failure within a high-Speed transceiver in complex sub-nano FPGA. This successful case is achieved by incorporating Analog Probe (APROBE), Infrared Emission Microscopy (IREM), extensive layout study, delayering, Nanoprobing and Scanning Electron Microscopy (SEM) for defect localization.