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William Ng
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Proceedings Papers
ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 191-195, November 14–18, 2010,
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This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2010) 12 (4): 44–46.
Published: 01 November 2010
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This column addresses the importance of information exchange among failure analysts and explains how it can be accomplished.