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William Lowe
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Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 269-276, October 30–November 3, 2022,
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As advanced device technologies scale to 5nm with dimensions getting smaller and materials change, it is difficult to control the sample preparation delayering end pointing by polishing. Therefore, it requires an alternative solution such as Xe+ PFIB (Plasma Focused Ion beam) Microscopy for accurate delayering control. PFIB can be used for planar Failure Analysis (FA) delayering but also for nanoprobing sample preparation. This paper introduces the detail of nanoprobing sample preparation by PFIB and discusses nanoprobing results on 5nm FinFET technology.
Proceedings Papers
ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 329-335, November 10–14, 2019,
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Nanoprobing systems have evolved to meet the challenges from recent innovations in the semiconductor manufacturing process. This is demonstrated through an exhibition of standard SRAM measurements on TSMC 7 nm FinFET technology. SEM based nanoprober is shown to meet or exceed the requirements for measuring 7nm technology and beyond. This paper discusses in detail of the best-known methods for nanoprobing on 7nm technology.