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William Courbat
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Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 427-431, November 12–16, 2023,
Abstract
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Key improvements to data acquisition, visualization and analysis are presented for Electrical Failure Analysis (EFA). Multi-channel image acquisition is introduced, where every nanoprobe is used for simultaneous imaging, in combination with color coding either by probe or by current. This new approach improves visualization of new device technologies with increasing three-dimensional complexity, in particular for overlapping structures and fields. Further, this new multichannel method opens opportunities for image mixing to improve data quality and signal interpretation.
Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 277-283, October 30–November 3, 2022,
Abstract
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The Electron Beam Induced Resistance Change (EBIRCH) technique is becoming more popular for localization of defects in Electrical Failure Analysis (EFA). Whilst EBIRCH is clear and straightforward in the procedure that must be followed for localization, it does not provide a direct understanding of the fundamental origin of its signal. This contribution addresses this significant shortfall in the technique, proposing a few basic experimental steps to be added to the technique in continuation of localization, with the principal aim of interrogating the physical origin of signal.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2019) 21 (4): 22–28.
Published: 01 November 2019
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A recent trend in semiconductor failure analysis involves combining the use of different tools and techniques in order to acquire more accurate data at a faster rate. This article describes a new workflow that combines FIB, GIS, and nanoprobing, all performed at the same FIB tilt position. It also provides two examples in which the workflow is used.