FA cannot consist of simply jumping to conclusions. The FA process is validated through correlation with the initial failure and through interpretation of the obtained results, subjective by definition. This paper illustrates the difficulty of analyzing complex failures caused by multiple factors, including wafer fabrication, assembly, and application conditions. Inter-Layer Dielectric (ILD) delamination was experienced on various ICs from the same 250nm technology. A complete set of techniques (C-SAM, laser and optical microscopy, SEM, FIB cross-sections, TEM, EFTEM, SIMS, Auger, delineation) was used as different pieces of the same puzzle to reveal the multiple factors contributing to the ILD delamination failures. Due to the subtle nature of some of the underlying causes, defining an accurate FA approach with appropriate sample preparation and accurate device traceability was critical to understanding this complex, multivariate issue.

Two cored wires L1 and L2, have been developed to produce arc-spraying coatings for treating high temperature erosion wear of four tubes in the power station, grit erosion experiments under various conditions such as temperature, incident angle, grit weight and shocking velocity have been taken, results show that coating L1 prepared by the new cored wire is more erosion resistance than the comparative materials 20g steel, coating L2 has different behavior varies with the distinct state, from the basis of surface structure and erosion performance, it is also concluded that coating L1 and L2 show mainly plastic erosion wear behavior during the grit erosion process.