This article describes how 3D Real Time X-Ray (RTX) technique enhances the capability of package-level failure analysis of a flip-chip package. 3D RTX was successful in detecting different failure signatures. This paper outlines detailed applications of 3D RTX with case studies.

This article describes how Focused Ion Beam (FIB) milling methodology enhances the capability of package-level failure analysis on flip-chip packages by eliminating the artifacts induced by using conventional mechanical techniques. Dual- Beam Focused Ion Beam (DB FIB) cross sections were successful in detecting failure mechanisms related either to the die/C4 bump or package defect inside the organic substrate. This paper outlines detailed sample preparation techniques prior to performing the DB FIB cross-sections, along with case studies of DB FIB cross-sections.