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Volker Sorger
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Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 346-351, November 12–16, 2023,
Abstract
View Papertitled, Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs - Exploring the Advantages of a Post-Photon Emission Technique
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for content titled, Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs - Exploring the Advantages of a Post-Photon Emission Technique
The increasing demand for semiconductor chips and the outsourcing of chip fabrication have heightened vulnerability to hardware security threats. While optical probing has been used extensively for semi-invasive/non-invasive attacks, its resolution limits and obsolescence in advanced technologies have necessitated exploring other techniques. Electron-beam probing (EBP) has emerged as a powerful method, offering 20x better spatial resolution than optical probing, and applies to sub- 7nm flip-chips and advanced 3D architecture systems. However, the increased resolution of EBP also poses a threat to sensitive information on these advanced chips, calling for developing countermeasures to secure assets. By understanding the capability of EBP, the potential of using EBP to extract sensitive data such as encryption keys, soft IP, neural network parameters, and proprietary algorithms will be discussed. This paper delves into the principles behind EBP, its capabilities, challenges for this technique, and potential applications in failure analysis and potential attacks. It highlights the need for developing effective countermeasures to protect sensitive information on advanced node technologies.