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1-3 of 3
Valerie Brogden
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Proceedings Papers
ISTFA2024, ISTFA 2024: Conference Proceedings from the 50th International Symposium for Testing and Failure Analysis, 153-156, October 28–November 1, 2024,
Abstract
View Papertitled, Increasing TEM Prep Throughput with an Extendable Manipulator Tip
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for content titled, Increasing TEM Prep Throughput with an Extendable Manipulator Tip
We introduce a novel piece of hardware that allows researchers to extend a nanomanipulator needle further into the vacuum chamber of a dual beam FIB SEM without venting the system. This hardware innovation will elevate throughput and diminish the instrument's downtime, which is pivotal for transmission electron microscope (TEM) sample preparation—a process integral to semiconductor manufacturers where the demand for TEM samples is high due to their necessity for process characterization and failure analysis of integrated circuits. Traditionally, the manipulator needle shortens with each sample preparation, ultimately reaching a mechanical limit that necessitates system venting to install a new needle. This hardware innovation allows users to feed out more needle length into the vacuum chamber by twisting a knob on the outside of the FIB SEM.
Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 413-419, November 9–13, 2014,
Abstract
View Papertitled, Application of Automated FIB for TEM Sample Preparation in Semiconductor Failure Analysis
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for content titled, Application of Automated FIB for TEM Sample Preparation in Semiconductor Failure Analysis
In this paper, we describe automated FIB for TEM sample preparation using iFast software on a Helios 450HP dual-beam system. A robust iFast automation recipe needs to consider as many variables as possible in order to ensure consistent sample quality and high success rate. Variations mainly come from samples of different materials, structures, surface patterns, surface topography and surface charging. The recipe also needs to be user-friendly and provide high flexibility by allowing users to choose preferable working parameters for specific types of samples, such as: grounding, protective layer coating, milling steps, and final TEM lamella thickness/width. In addition to the iFast recipe, other practical factors affecting automation success rate are also discussed and highlighted.
Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 485-490, November 9–13, 2014,
Abstract
View Papertitled, Will Tomorrow’s Failure Analysis Lab Operate More Like Today’s Fab?
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for content titled, Will Tomorrow’s Failure Analysis Lab Operate More Like Today’s Fab?
Efficiencies in operation are achieved largely in advanced failure analysis (FA) labs because routine steps or processes have been automated and the need for operator interaction minimized. Very few operators are required to run a fully automated, "lights out" type Fab. This paper discusses the various automation components which are available to labs as they look to streamline the FA process to support the Fab's ever increasing demand for more process data. These include iFast Automation software and automated recipes to create the thick lamella. The development of automation software and integrated accessories for FA equipment is now bringing more Fab-like activities and processes into the FA lab. As more and more automation moves into the FA lab, one should not be surprised in a few years to see very few operators sitting in front of tools with blinking green lights scattered throughout the lab.