This paper analyzes the through-put time and output of fault isolation and failure analysis (FI/FA) flows on state-of-the-art microprocessors. An average reduction in through-put time of 40% was demonstrated with a shortened FI/FA flow while still maintaining a high success rate. The direct FA/nano-probing flow which was utilized by up to around 90% of the fail cases omitted the optical fault isolation step and instead expanded the use of plasma FIB, nano-probing and electrical isolation techniques (such as diagnosis tools). The end result is shorter through-put time and higher FI/FA volume which is important in order to achieve a faster production ramp. In the paper two cases studies are presented to demonstrate the new efficient FI/FA techniques.

Resolution of optical fault isolation (FI) and nanoprobing tools needs to keep pace with the device downscaling to be effective for semiconductor process development. In this paper we present and discuss state-of-the-art FI and nanoprobing techniques evaluated on Intel test-chips fabricated on next generation process technology. Promising results were obtained but further improvements are necessary for the 7nm node and beyond.