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Tomokazu Nakai
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Proceedings Papers
A Novel Junction Profiling Methodology
Available to Purchase
ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 171-175, November 14–18, 2010,
Abstract
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for content titled, A Novel Junction Profiling Methodology
Currently many methods are available to obtain a junction profile of semiconductor devices, but the conventional methods have drawbacks, and they could be obstacles for junction profile analysis. This paper introduces an anodic wet etching-based two-dimensional junction profiling method, which is practical, efficient, and reliable for failure analysis and electrical characteristics evaluation.
