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1-5 of 5
Tommaso Melis
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Proceedings Papers
ISTFA2024, ISTFA 2024: Tutorial Presentations from the 50th International Symposium for Testing and Failure Analysis, c1-c59, October 28–November 1, 2024,
Abstract
View Papertitled, Analog Simulation and Fault Simulation for Failure Analysis of Analog Circuits
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for content titled, Analog Simulation and Fault Simulation for Failure Analysis of Analog Circuits
Presentation slides for the ISTFA 2024 Tutorial session “Analog Simulation and Fault Simulation for Failure Analysis of Analog Circuits.”
Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 177-186, November 12–16, 2023,
Abstract
View Papertitled, Fault Simulation for Dynamic Failures in Analog and Mixed Signal Circuits
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for content titled, Fault Simulation for Dynamic Failures in Analog and Mixed Signal Circuits
The localization of defects that cause dynamic electrical behavior is a constant challenge for failure analysts. Such types of failures are often present in analog circuits, and standard fault isolation techniques are constrained and not always successful. In this paper, we demonstrate a method to exploit industrial fault simulators in conjunction with standard analysis methods to solve analyses in analog circuits. In addition, we will show methods to adapt fault simulation to these dynamic electrical failure modes. Successful fault isolation results from real-world failure analyses of oscillators, which are typical inside analog and mixed-signal circuits.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090063
EISBN: 978-1-62708-462-8
Abstract
This chapter sheds light on the challenges involved in diagnosing faults in analog, mixed-signal, and RF circuits. It describes some of the work being done to leverage the benefits of standardization, improve fault simulation tools, and overcome limitations on optical fault isolation techniques. One of the solutions being considered is to integrate LEDs throughout the analog circuit, thereby using light to report the status of internal signals.
Proceedings Papers
ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 91-99, November 15–19, 2020,
Abstract
View Papertitled, Analog and Mixed Signal Diagnosis Flow Using Fault Isolation Techniques and Simulation
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for content titled, Analog and Mixed Signal Diagnosis Flow Using Fault Isolation Techniques and Simulation
Getting accurate fault isolation during failure analysis is mandatory for success of Physical Failure Analysis (PFA) in critical applications. Unfortunately, achieving such accuracy is becoming more and more difficult with today’s diagnosis tools and actual process node such as BCD9 and FinFET 7 nm, compromising the success of subsequent PFA done on defective SoCs. Electrical simulation is used to reproduce emission microscopy, in our previous work and, in this paper, we demonstrate the possibility of using fault simulation tools with the results of electrical test and fault isolation techniques to provide diagnosis with accurate candidates for physical analysis. The experimental results of the presented flow, from several cases of application, show the validity of this approach.
Proceedings Papers
ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 183-190, October 28–November 1, 2018,
Abstract
View Papertitled, Use of Analog Simulation in Failure Analysis: Application to Emission Microscopy and Laser Voltage Probing Techniques
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for content titled, Use of Analog Simulation in Failure Analysis: Application to Emission Microscopy and Laser Voltage Probing Techniques
This paper describes a novel flow using analog simulations for the failure analysis of digital, analog, and mixed signal devices. Although cell level diagnosis tools are available in the industry, it presents a solution through analog intra-cell simulation particularly advantageous when multiple defects give the same fault result at cell level. Details of case studies such as the one analog intracell simulation on digital device and the analog laser voltage probing are covered. The aim of the simulation solution proposed is to support the failure analyst to interpret emission images on analog devices. The presented analog simulation flow consists of computing the current (or current density) in MOS and bipolar transistors and simulating the internal waveforms in digital or analog cells. It enables failure analysts to interpret light emission and laser voltage probing results obtained on a physical device in a fast and efficient way.