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Tohru Koyama
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Proceedings Papers

3-D EBIC Technique using FIB and EB Double Beam System

Eiji Yoshida, Tomohiro Tanaka, Taro Oyamada, Tohru Koyama, Junko Komori ...
ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 163-168, November 6–10, 2005,
https://doi.org/10.31399/asm.cp.istfa2005p0163
Abstract
We propose visualizing techniques of a diffusion layer using an electron beam induced current (EBIC) for a site-specific cross-section formed by focused ion beam (FIB) treatment. Moreover, we present a three-dimensional (3-D) EBIC technique using a double beam (FIB & EB) system to understand the diffusion structure. This 3-D application of the EBIC technique is very useful for delineating PN junctions and pointing out implant defects in ULSI devices. Furthermore, we applied the EBIC technique to backside circuit editing with FIB. The end-point of the silicon trench etching can be easily decided by observing the plane EBIC images. Highly reliable backside circuit editing becomes possible together with a DUV laser marking technique using an IR-optical microscope system.
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Journal Articles

Performance of Forming Substrate into Solid Immersion Lens (FOSSIL) for Backside Fault Isolation Techniques

Tohru Koyama, Eiji Yoshida, Junko Komori, Yoji Mashiko
Journal: EDFA Technical Articles
EDFA Technical Articles (2004) 6 (2): 21–27.
DOI: https://doi.org/10.31399/asm.edfa.2004-2.p021
Published: 01 May 2004
Abstract
Conventional backside imaging takes advantage of silicon’s transmission of light which, based on the Plank relation ( E g = hc/ λ ), occurs at wavelengths greater than 1 µm. Because of diffraction, the lateral spatial resolution of backside imaging techniques is limited to about half the wavelength of the light source used, which is far too coarse to isolate faults in a typical IC. In this article, the authors explain how they overcome this limitation by reprofiling the backside of the silicon, forming spherically shaped domes. The raised convex surfaces act as solid immersion lenses that are shown to improve spatial resolution by nearly an order of magnitude. The degree of improvement is evaluated using backside emission microscopy (EMS), optical beam induced current (OBIC) imaging, and laser voltage probing (LVP) and the results are presented in the article.
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