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Proceedings Papers

Inter Layer Dielectric Defect Induced High Contact Resistance

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Re-Long Chiu, Jason Higgins, Toby Kinder, Juha Tyni, Sharon Ying ...
ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 54-57, November 14–18, 2010,
https://doi.org/10.31399/asm.cp.istfa2010p0054
Abstract
High contact resistance can be caused by moisture absorption in low phosphorus content BPTEOS. Moisture diffused through the TiN glue layer is absorbed by the BPTEOS during subsequent thermal processes resulting in increased contact resistance. This failure mode was studied by combining different failure analysis methods and was confirmed by duplication on experimental wafers.
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