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Cheryl D. Hartfield, Thomas M. Moore, Sebastian Brand
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Thomas M. Moore
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Book Chapter
Acoustic Microscopy of Semiconductor Packages
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
Abstract
The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.
Proceedings Papers
Nanomechanical Characterization in the FIB
Available to Purchase
ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 209-211, November 6–10, 2005,
Abstract
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The availability of the focused ion beam (FIB) microscope with its excellent imaging resolution, depth of focus and ion milling capability has made it an appealing platform for materials characterization at the sub-micron, or "nano" level. This article focuses on nanomechanical characterization in the FIB, which is an extension of the FIB capabilities into the realm of nano-technology. It presents examples that demonstrate the power and flexibility of nanomechanical testing in the FIB or scanning electron microscope with a probe shaft that includes a built-in strain gauge. Loads that range from grams to micrograms are achievable. Calibration is limited only by the availability of calibrated load cells in the smallest load ranges. Deflections in the range of a few nanometers range can be accurately applied. Simultaneous electrical, mechanical, and visual data can be combined to provide a revealing study of physical behavior of complex and dynamic nanostructures.
Journal Articles
Roadmap: The Assembly Analytical Forum: Addressing The Analytical Challenges Facing Packaging and Assembly
Available to Purchase
Journal: EDFA Technical Articles
EDFA Technical Articles (2001) 3 (4): 15–19.
Published: 01 November 2001
Abstract
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Over the last few years, new challenges increased the pressure on packaging and assembly analytical resources. Reduced product development cycle time, increased market segmentation, new package and die level materials, ever shrinking device geometries, and fully enabled technologies (i.e. with thermal, retention, and EMI solutions) created these new pressures on fault isolation/failure analysis efforts and package development.