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Tanawat Butngam
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Proceedings Papers
ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 182-188, November 15–19, 2009,
Abstract
View Papertitled, Instrumental Discrepancy and Relation of Stress Condition between ESD Association and JEDEC Standards on ESD CDM Test
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for content titled, Instrumental Discrepancy and Relation of Stress Condition between ESD Association and JEDEC Standards on ESD CDM Test
Instrumental difference including characteristic aspects between ESDA and JEDEC standards on CDM test have been investigated and discussed. ESDA test systems provides higher discharge current, lower rise time and lower full width at half maximum at the same stress level, which is due to the higher inductance in the discharge path. We have succeeded in finding out the linear relation of the stress condition between these 2 standards. Furthermore, the current monotonically increases with the stress level for all capacitances and depends on the package size as expected. The relationship between current and package area is proportional because a larger package affords a higher capacitance. The current tends to saturate with a package size over 250 mm2 in both standards. The electrical failure yield of each standard system can be predicted by a stress condition of the other. The stress condition in JEDEC standard is undoubtedly a subset of the ESDA standard.