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T.E. Kim
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Proceedings Papers
ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 76-80, November 15–19, 2009,
Abstract
View Papertitled, The SRAM Soft Failure Analysis with SNM & TR Characterization by Nanoprobing in Sub 45nm
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for content titled, The SRAM Soft Failure Analysis with SNM & TR Characterization by Nanoprobing in Sub 45nm
This paper presents the process of measuring static noise margin (SNM), write noise margin (WNM) with 6 pin nanoprober, and characterization and analysis of SRAM cell stability through case studies of 45nm devices SRAM soft failures. It highlights that the local mismatch in the bit cell caused by slight variations in the transistor characteristics, such as Vth shift and Idsat, off variation, also can easily induce a soft failure. The analysis of the SNM TR characteristic is successfully demonstrated through the case study of 45nm SRAM devices. The chapter explains SNM measurement in the metal layer and transistor measurements in the CA layer. Measuring the SNM TR's characteristics is an important methodology in understanding the stability of each bit cell and failure mechanism depending on voltage, defects, and other factors. The next generation of nanoprobing analysis can be expanded.