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Ryan Ross
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Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 163-169, October 30–November 3, 2022,
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While 2.5D and 3D solutions continue to drive advancements in the electronics packaging industry, challenges persist with their reliability and qualification. In this paper, we introduce a new technique that may prove valuable for nondestructive, in-situ measurements of package and die warpage. This system allows for the powerful visualization tools of Computed Tomography to be applied to samples at elevated and cryogenic temperatures over a broad temperature range (+125C to -257C).
Proceedings Papers
ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 519-521, November 10–14, 2019,
Abstract
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Characterization of Computed Tomography X-Ray ionizing dose will be presented along with a methodology to protect space bound flight hardware from exceeding total ionizing dose (TID) budget prior to mission completion.
Proceedings Papers
ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 631-634, November 5–9, 2017,
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This paper presents the failure analysis on a 1.5m flex harness for a space flight instrument that exhibited two failure modes: global isolation resistances between all adjacent traces measured tens of milliohm and lower resistance on the order of 1 kiloohm was observed on several pins. It shows a novel method using a temperature controlled air stream while monitoring isolation resistance to identify a general area of interest of a low isolation resistance failure. The paper explains how isolation resistance measurements were taken and details the steps taken in both destructive and non-destructive analyses. In theory, infrared hotspot could have been completed along the length of the flex harness to locate the failure site. However, with a field of view of approximately 5 x 5 cm, this technique would have been time prohibitive.
Proceedings Papers
ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 330-331, November 14–18, 2010,
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Driving yield improvement activities to decrease baseline logic / scan yield fallout is often perceived as a challenging or complex activity. Much of this perception is based on yield or device teams historical interactions with the FA teams on these types of requests. This paper will present our methodology for generating a relatively high volume of scan FA results in a short time frame. This type of high volume scan FA enables real time FA paretos of what is causing scan / logic yield loss.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2006) 8 (2): 14–20.
Published: 01 May 2006
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This article assesses the capabilities of failure analysis techniques in the context of 65 nm CMOS ICs. It demonstrates the use of OBIRCH, voltage contrast, Seebeck effect imaging, SEM and TEM techniques, and FIB cross-sectioning on failures such as dielectric breakdown, open and resistive vias, voids, shorts, delaminations, and gate oxide defects.
Proceedings Papers
ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 169-171, November 3–7, 2002,
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For its latest generation of high performance logic applications, Motorola employs a 0.13 µm CMOS technology with shallow trench isolation (STI). The contact dimension and spacing requirements for the dense areas of the circuitry, such as the cache, are quite aggressive. We recently encountered single bit and massive array failures, which were traced to an electrical short between tungsten contacts. We report here the failure analysis, which involved electrical and physical testing techniques.