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1-6 of 6
Richard H. Livengood
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Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 179-180, October 30–November 3, 2022,
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Modern processors rely heavily on memory arrays close to the logical processers to have minimal latencies and highest bandwidth for optimal performance. There are memory arrays in the client and server which are configured to different levels based on the size and latency required for the tasks. These memory arrays are separated into bit lines and word lines to address single bits and retrieve required data from the address of the memory location. In any new server validation, a memory access error can happen if the logical to physical memory address is not confirmed. This can lead to corrupt data and operation failure. We have employed here, novel targeted Focused Ion Beam (FIB) milling techniques for Logical to Physical (L2P) memory addressing validation and correction.
Proceedings Papers
Christopher M. Scheffler, Richard H. Livengood, Haripriya E. Prakasam, Michael W. Phaneuf, Ken Lagarec
ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 382-390, November 6–10, 2016,
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This paper provides information on ion beam dose delivery and machining a perfect pattern in an ideal world and summarizes the various beam control limitations of the current generation systems. It discusses conventional and proposed solutions to these limitations and highlights their effect on minimum dimension nanomachining applications at the 14 nm Si process node and beyond. The paper highlights the solutions that can be implemented to help negate inconsequential effects of systems. With that in mind, the most significant of these factors in limiting a tool's ability to complete a perfect pattern can be grouped into two categories: timing and placement and non-uniform dose delivery. With good understanding and discipline, most of these issues described can be corrected, significantly minimized, or simply avoided.
Proceedings Papers
ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 436-439, November 11–15, 2012,
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The requirements for focused ion beam (FIB) systems to provide higher image resolution and machining precision continue to increase with the continuation of Moore’s Law. Due to the shrinking geometry and increasing complex structures and materials, it is ever more critical to scale the entire ion probe. The necessity for comprehensive analysis of the ion beam profile and understanding how the ion beam current distribution profile influences different aspects of nanomachining are becoming increasingly important and more challenging.
Proceedings Papers
ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 505-508, November 11–15, 2012,
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High resolution optical imaging is critical in assisting backside circuit edit (CE) and optical probing navigation. In this paper, we demonstrated improved optical image quality using VIS-NIR narrow band light emitting diode (LED) illumination in various FIB and optical probing platforms. The proof of concept was demonstrated with both common non-contact air gap lenses and solid immersion lenses (SIL).
Proceedings Papers
ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 40-45, November 13–17, 2011,
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Nanomachining capability scaling both in the areas of machining precision and novel gas chemistries are required for focused ion beam technology to keep pace with process technology advancement. In this paper, we review the nanomachining potential for the Helium Ion Microscope (HIM) and the Neon Ion Microscope (NIM). The paper also includes an in depth analysis of NIM imaging resolution, subsurface material interaction, and nanomachining performance.
Proceedings Papers
ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 559-568, November 3–7, 2002,
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We present for the first time the results of a comprehensive study of the increase in propagation delay of multi-GHz digital signals due to backside FIB fabricated interconnects. Signal propagation delays were measured in 90nm CMOS technology circuits as a function of interconnect material properties and physical dimensions. We compare the empirical results of this study to SPICE calculations, which were based on an equivalent circuit element model of the interconnect. We show that the empirical data obtained in these experiments supports the validity of the equivalent electrical model for the frequency range typically encountered in modern microprocessor debug. Based on the results or our analysis, we comment on the future capability of backside FIB circuit edit (CE) interconnection technology as it pertains to the debug of flip-chip packaged IC’s operating at multi-GHz frequency.