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Rajesh Kabadi
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Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 100-109, October 30–November 3, 2022,
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Failure Analysts are often required to work on a vast array of part types. These integrated circuits (IC) can have wide ranging functions and applications. Also, the ICs can be offered in a multitude of package types. All these factors compound the challenges faced by the Failure Analysts. This paper provides a brief snapshot of one approach adopted by the ON Semiconductor Product Analysis Labs to prepare in advance for the products that offer significant challenges in terms of electrical bench testing and fault localization. The approach demonstrates how the prospects of success of a given failure analysis (FA) case can be improved by making available smart solutions that cut down on the effort required for bench testing, defect localization and failure verification activities. This in turn can contribute to cycle time reduction and improve overall efficiency of the FA process.
Proceedings Papers
ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 148-153, November 10–14, 2019,
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Given the challenges FA Engineers have in fault localization, top-side analysis is facing a major challenge with today’s advanced packaging and shrinking of die sizes. At wafer and die level it is relatively easy to probe with little or no sample preparation. Greater challenges occur after the die is packaged. The difficulty further lies in non-destructively analyzing the die. Another issue with failure analysis is accurately deprocessing the device for probe pad deposition. Techniques like Electro Optical Probing (EOP) or Laser Voltage Probing (LVP) acquire electrical signals on transistors and create an activity map of the circuitry. In failure analysis, it is applied to localize defects. This paper discusses integrating EOP techniques in traditional FA to localize failure in mixed signal ICs. Three case studies were presented in this paper to establish the technique to be effective, quick and easy to probe non-invasively with minimal backside sample preparation.