Non-volatile memory is the most important memory device in IC chips. As a memory, embedded non-volatile memory (NVM) is a fundamental structure in many kinds of semiconductor devices. It is commonly used in the modern electrical appliance as a code or data memory. For different applications, there are different memory designs or IP, like ROM, OTP, Flash, MRAM, PCRAM etc. The physical mechanism of these NVMs are different, some are electron based, some are resistance based and fuse or anti-fused based. The experiment described in this paper is performed on an electron charge storage based NVM. That means a medium is employed to store electron charge to differentiate two statuses “0” and “1”. Floating Poly gate is this medium used as electron charge storage in this NVM. Since the storage medium is in floating condition, it cannot be accessed externally. The methods of performing direct analysis are limited for this kind of device, especially in the case of subtle defects or soft fail. As semiconductor devices scale, the defects become smaller and more subtle. Nanoprobing is usually the only way to find the defect location electrically before any further physical analysis. In this experiment, the single bit NVM fail was analyzed. Different PFA methods used during the analysis, failed to find the defect. Nanoprobing was employed to precisely isolate the defect. Key word: nanoprobing, NVM, subtle defect, Poly-crystalline, floating gate

Reliability tests, such as Time-Dependent Dielectric Breakdown (TDDB), High-Temperature Operating Life (HTOL), Hot Carrier Injection (HCI), etc., is required for the lifetime prediction of an integrated circuit (IC) product. Those reliability tests are more stringent and complex especially for automotive Complementary Metal–Oxide–Semiconductor (CMOS) devices, this because it involves human lives and safety. In foundries failure analysis (FA), Transmission Electron Microscopy (TEM) analysis often required in order to provide insights into the defect mechanisms and the root cause of the reliability tests. In this paper, application of high resolution Nano-probing Electron Beam Absorbance Current (EBAC), Nano-probing active passive voltage contrast (APVC), and TEM with Energy Dispersive X-Ray Spectroscopy (EDX) to identify the failing root cause of Inter- Poly Oxide (IPO) TDDB failure on an automotive grade Non- Volatile Memory (NVM) device was investigated. We have successfully demonstrated that TEM analysis after Nanoprobing EBAC/APVC fault isolation is an effective technique to reveal the failure root cause of IPO breakdown after reliability stresses.

This paper describes a low yield case which results in a unique 68 mm single ring wafer sort failure pattern. A systematic problem solving approach with the application various FA techniques and detailed Fab investigation resolved the issue. The root cause for the unique ring failure pattern was due to a burr at the implanter load lock. The burr scratched and toppled the photoresist resulting in subsequent blocked well implantation and memory failure.

Fundamental properties of Titanium coating prepared by low temperature HVOF process aided by injection of water had been published by our research group. The results showed that low temperature HVOF process provided as a good means for the deposition of comparatively dense Ti coating, however the interconnected pores observed in Ti coating degraded corrosion resistance of Ti coating, therefore it was necessary to manufacture denser Ti coating. Two processes were respectively applied for the densification of Ti coating. One process was to perform post heat treatment for as-sprayed Ti coating with conventional Ti powder as feedstock. The other process was to modify thermal spray powder. Ti powder mixing with spherical glass powder was used to deposit denser Ti coating as a result of shot peening effect of hard glass powder. Finally the corrosion resistance for densified Ti coatings was evaluated by electrochemical characterization.

This paper introduces the GKM (Grosskraftwerk Mannheim AG) test rig, designed to evaluate new Ni-based alloys and austenitic steels for components in advanced 700°C power plants under real operational conditions. The test rig, integrated into a conventional coal-fired power plant in Mannheim, Germany, simulates extreme conditions of up to 725°C and 350/200 bar pressure. After approximately 2000 hours of operation, the paper presents an overview of the rig's design, its integration into the existing plant, and the status of ongoing tests. It also outlines parallel material investigations, including creep rupture tests, mechanical-technological testing, and metallurgical characterization. This research is crucial for the development of materials capable of withstanding the severe conditions in next-generation power plants, potentially improving efficiency and performance in future energy production.