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1-6 of 6
Prasad Sabbineni
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Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 120-124, October 30–November 3, 2022,
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Infrared lock-in thermography systems are frequently utilized for non-destructive failure analysis of integrated circuits due to sensitivity of the thermal detector to small temperature changes from electrical activity. This thermal sensitivity can also be leveraged for design verification and debug of device thermal management via absolute temperature mapping. The application of temperature mapping to a device under test (DUT) that requires boards and sockets, such as in tester based applications, has traditionally been challenging, due to the requirement that the DUT not be moved and the difficulty of heating the DUT through the thermal mass of the boards and sockets to which the DUT is mounted. This paper describes a proposed alternative single-temperature in-situ calibration method to eliminate the need for a heated thermal chuck for absolute temperature mapping. Preliminary results are promising and show that the new alternative single-temperature in-situ method results in temperature measurements within 1 °C close to room temperature and within 2.5 °C at elevated temperatures up to approximately 75 °C, as compared to the 1 °C accuracy of the current standard two-temperature in-situ method. While this alternate method is not as accurate as the standard two-temperature in-situ calibration method, the fact that it can be performed at a single room temperature means that it enables absolute temperature mapping for use cases requiring boards or socketed DUTs, as is the case for tester applications. An example characterization of a DUT utilizing varying clock signal inputs shows the added flexibility and ease of setup that the alternative single-temperature workflow brings, creating new opportunities for use-cases such as boards and testers where the use of a heated thermal chuck is not viable.
Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 125-128, October 30–November 3, 2022,
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Recently, electron beam probing (EBP) has had a resurgence in failure analysis communities due to its clear resolution advantage compared to optical techniques. This paper describes an approach for a detailed advanced logic e-beam probing system, capable of measuring both high bandwidth waveforms and frequency maps. An investigation of optimizing the signal-to-noise of the pulsed beam is presented. By minimizing the working distance and the use of quadrature signal analysis, the e-beam prober is capable of high bandwidth and high-resolution data with adequate signal-to-noise. The use of such system provides a scalable solution for electrical failure analysis for advanced logic integrated circuits.
Proceedings Papers
ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 116-121, November 15–19, 2020,
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Working on wafer-level has been the only way of performing electrical failure analysis (EFA) without the need for die-packaging. The introduction of Si-interposer based 2.5D packaging, with high bandwidth memory (HBM) stacks surrounding our GPU chip, drastically increasing packaging turn around times from approximately 3 days to 3-4 weeks. Having to wait more than 3 weeks for EFA and debug work of 1st Silicon chips is a significant risk for chip bring-up. To address these challenges, this paper presents different ways of reusing the existing wafer-level EFA tool for single die EFA, and introduces a concept for a novel and dedicated single die tool. Additionally, singulated die fixturing and support windows are designed to enable the usage of a 2.45 Numerical Aperture Solid Immersion Lens, and first results from a near reticle limited 16 nm Fin-FET GPU product are also presented.
Proceedings Papers
ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 334-338, October 28–November 1, 2018,
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In high numerical aperture (NA) subsurface imaging, we can obtain higher resolution in selected directions at the expense of resolutions in other directions, utilizing the vectorial properties of polarized light. In this work, we propose an image fusion framework that produces a single image with higher resolution and image quality in all directions by processing multiple images acquired by varying the polarization direction of the linearly polarized input laser light.
Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 335-339, November 9–13, 2014,
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Laser-voltage probing (LVP) and imaging (LVI) using a continuous-wave (CW) 1320-1340nm laser have become mainstream techniques for electrical fault isolation. A 1064nm laser with a 20% shorter wavelength offers immediate resolution advantages compared to 1320nm at a cost of increased intrusion. This paper explores the potential of CW 1064nm laser and identifies opportunities in fault isolation
Proceedings Papers
ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 128-134, November 11–15, 2012,
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In this paper, near-infrared photon emission spectroscopy measurements from ring oscillators in 45 nm and 32 nm SOI process technology are compared. Employing a cryogenically cooled camera, the measurements cover a broad spectral range from 1200-2200 nm. Both leakage and switching emission, increase monotonically with the wavelength, suggesting measurements should be made at longer wavelengths than has historically been practiced. The paper discusses the optimum cut-off wavelength for maximum signal-to-noise ratio and the obvious importance of reduced ambient temperature for performing measurements.