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Ping Wang
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Proceedings Papers
ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 230-233, November 1–5, 2015,
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Embedded non-volatile memory (NVM) technologies are used in almost all areas of semiconductor chip applications, as it becomes increasingly vital to retain information when the electronics power is off. Nano-probing techniques, such as atomic force probe (AFP), allow us to access individual devices at contact or via levels and characterize the details as much as possible before a decision can be made for physical analysis. This paper reports the application of AFP to characterize each individual bit at contact level or individual column at via1 level. It presents two cases to identify the failures encountered in fabricated embedded NVM: column-column leakage and single bit erase failure. The first case shows that silicide residual could cause column to column leakage by creating electrical path between active areas of adjacent columns, while the second case shows that single bit failures due to low erase current can be recovered with repeated program/erase cycle.
Proceedings Papers
AM-EPRI2013, Advances in Materials Technology for Fossil Power Plants: Proceedings from the Seventh International Conference, 276-280, October 22–25, 2013,
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Delivered condition of Inconel740H specified in ASME Code Case 2702 is solution heat treated and aged condition, fabricating performances are also based on the condition, and a re-annealing and aging shall be performed if cold forming to strains is over 5%. These almost harsh requirements bring great inconvenience for its engineering practice and utilization. The comparative bending tests on 740H tubes in solution heat treated + aged condition and solution heat treated condition were performed, and the rules’ reasonability of the specification on delivered condition was discussed and analyzed from point view of deformability and weldability in the paper. The bending test results showed that tube bent was difficult because of its high strength and limited deforming capacity in solution heat treated + aged condition. Therefore, the material supplied in the solution condition may be better from fabricating points. Whether re-solution for the bent tube is performed after bending depends on its bending radius, followed by welding and post weld heat treatment of component (this treatment can also be the aging treatment for annealed sector at the same time), this treating manner can meet regulatory requirements. For solution tubes, however, there are some inconveniences to its engineering application because fewer research studies were carried out on its properties up to now, and no regulations on them were given for the material in the specification. Suggestions are: 1) deeply investigating the properties of tubes in solution condition, including mechanical and fabricating performances, 2) adding the mechanical properties, maximum allowable cold forming to stain without performing re-solution and weld strength reduction factor of solution material to the code case.