FIB Micromachining has long been an established technique, but until recently it has been overshadowed by the more mainstream semiconductor application of the Focused Ion Beam system. Nano- Structure fabrication using the FIB system has become more popular recently due to several factors. The need for sub-micron structures have grown significantly due to a need for enhanced optical and biological applications. Another reason for the growth in micromachining is the improvement made in the ability of FIB systems to produce geometric shapes with high precision. With the latest high-end FIB systems, it is possible to produce microstructures with tens of nano-meters of precision. Optical lens, AFM tips, and nano-apertures are all part of the growing application for FIB Micromachining. This paper will discuss the ability and limitations of the FIB system and some possible application for FIB Micromachining.

The extensive use of planarization in many of today's leading process technologies significantly reduces the effectiveness of FIB circuit modification and debugging. Planarization has played a significant role in the development of denser chips with increasingly smaller geometries. Fully planarized devices offer little or no surface features on which the FIB operator relies for orientation and alignment. These conditions lead to increased debug cycle times and decreased success rates using the FIB. Recent FIB tool advancements in the field of C4 (controlled-collapse chip connection) flip-chip packaged device modification and debug have also made it easier to work on highly planarized conventional wire-bond technology. The integration of an optical microscope with an infrared camera into the work chamber allows the operator to view the circuitry under the surface layer. This paper will offer several techniques for overcoming the challenges that planarized devices present by using this in-situ optical microscope. When properly implemented, these techniques can significantly improve the success rate and throughput time of device modification on highly planarized parts.