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Niyanth Sridharan
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Proceedings Papers
AM-EPRI2024, Advances in Materials, Manufacturing, and Repair for Power Plants: Proceedings from the Tenth International Conference, 735-749, October 15–18, 2024,
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This study investigates a novel approach to addressing the persistent Type IV cracking issue in Grade 91 steel weldments, which has remained problematic despite decades of service history and various mitigation attempts through chemical composition and procedural modifications. Rather than further attempting to prevent heat-affected zone (HAZ) softening, we propose eliminating the vulnerable base metal entirely by replacing critical sections with additively manufactured (AM) weld metal deposits using ASME SFA “B91” consumables. The approach employs weld metal designed for stress-relieved conditions rather than traditional normalizing and tempering treatments. Our findings demonstrate that the reheat cycles during AM buildup do not produce the substantial softening characteristic of Type IV zones, thereby reducing the risk of premature creep failure. The study presents comprehensive properties of the AM-built weld metal after post-weld heat treatment (PWHT), examines factors influencing deposit quality and performance, and explores the practical benefits for procurement and field construction, supported by in-service data and application cases.
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006574
EISBN: 978-1-62708-290-7
Abstract
Ultrasonic additive manufacturing (UAM) is a solid-state hybrid manufacturing technique that leverages the principles of ultrasonic welding, mechanized tape layering, and computer numerical control (CNC) machining operations to create three-dimensional metal parts. This article begins with a discussion on the process fundamentals and process parameters of UAM. It then describes metallurgical aspects in UAM. The article provides a detailed description of a wide range of mechanical characterization techniques of UAM, namely tensile testing, peel testing, and pushpin testing. The article ends with information on sensor embedding.