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Motohiko Masuda
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Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 184-188, November 9–13, 2014,
Abstract
View Papertitled, Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package
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for content titled, Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package
Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.
